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1、TP04PUB284WireBondingChallengesinOptoelectronicsPackagingauthor(s)JIANBIAOPAN,PHDCaliforniaPolytechnicStateUniversitySanLuisObispo,CaliforniaPATRICEFRAUDNPOSConsultingLosAngeles,CaliforniaabstractWirebondinghasbeenusedinintegratedcircuit(IC)packagingformanyyears.However
2、,therearemanychallengesinwirebondingforoptoelectronicspackaging.Thesechallengesincludebondingonsensitivedevices,bondingovercavity,bondingovercantilevelleadsandbondingtemperaturelimitations.Theoptoelectronicspackagedesignbringsanotherchallenge,whichrequireswirebondingtoh
3、avedeepaccesscapability.Inthispaper,thewirebondingtechnologiesarereviewedandballbondingandwedgebondingarecompared.Thevariablesthataffectthewirebondingprocessarethendiscussed.Finally,thechallengesofwirebondinginoptoelectronicspackagingarepresentedindetail.termsWireBondin
4、gOptoelectronicsPackagingBallBondingWedgeBondingTECHNICALPAPERSocietyofManufacturingEngineers■OneSMEDrive■P.O.Box9302004Dearborn,MI48121■Phone(313)271-1500■www.sme.orgSMETECHNICALPAPERSThisTechnicalPapermaynotbereproducedinwholeorinpartinanyformwithouttheexpresswrittenp
5、ermissionoftheSocietyofManufacturingEngineers.Bypublishingthispaper,SMEneitherendorsesanyproduct,serviceorinformationdiscussedherein,noroffersanytechnicaladvice.SMEspecificallydisclaimsanywarrantyofreliabilityorsafetyofanyoftheinformationcontainedherein.WireBondingChall
6、engesinOptoelectronicsPackagingJianbiaoPan,Ph.D.PatriceFraudAssistantProfessorSr.TechnicalConsultantDepartmentofIndustrial&NPOSConsultingManufacturingEngineering2225S.BeverlyGlenBlvd.CaliforniaPolytechnicStateUniversitySuite104SanLuisObispo,CA93407LogAngeles,CA90064Phon
7、e:(805)756-2540Phone:(310)441-9857Email:pan@calpoly.eduEmail:pfraud@attglobal.netAbstractWirebondinghasbeenusedinintegratedcircuit(IC)packagingformanyyears.However,therearemanychallengesinwirebondingforoptoelectronicspackaging.Thesechallengesincludebondingonsensitivedev
8、icessuchasLithiumNiobateandIndiumPhosphide,bondingovercavity,bondingovercantilevelleads,andbondingtemperaturel
