wire_bonding__介绍

wire_bonding__介绍

ID:42030368

大小:2.47 MB

页数:97页

时间:2019-09-05

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1、WIREBONDWIREBONDPROCESSINTRODUCTIONCONTENTSÂASSEMBLYFLOWOFPLASTICICÂWireBond原理ÂM/CIntroductionM/CIntroductionÂWireBondProcessWireBondProcessÂMaterialÂSPECÂCalculatorÂDEFECT封裝簡介晶片Die金線GldWiGoldWire導線架Leadfram封裝流程WaferGrindingWaferSawDieBondingtoasterWireBondingDieSurfaceMo

2、ldingLaserMarkCoatingSolderBallBGASingulationPlacementSolderDejunkSURFACEDejunkPackingPlatingTRIMMOUNTPKGTRIMTHROUGHSolderTRIM/HOLEPKGPlatingFORMINGWireBond原理WedgeBondBallBond(2dBd)(2ndBond)(1stBond)GoldwirepadleadB.PRINCIPLEPRESSUREVIBRATIONAL2O3MOISTURECONTAMINATIONGOLD

3、BALLGLASSAlSiO2Si銲接條件ÂHARDWELDINGÂPressure(Force)ÂAmplif&Flify&FrequecyÂWeldingTime(BondTime)WeldingTime(BondTime)ÂWeedgepatue(eate)ldingTempature(Heater)ÂTHERMALBONINGÂThermalCompressureÂUltrasonicEnergy(Power)BondHeadASSY•Lowimpactforce•RealtimeBondingForcemonitoringRea

4、ltimeBondingForcemonitoring•Highresolutionz-axispositionwith2.5micronperstepresolutionstepresolution•Fastcontactdetection•SuppressedForcevibrationSuppressedForcevibration•FastForceresponse•FtFastresponsevoiicecoilililwireclampXYTable•Linear3phaseACServomotor•HighpowerACCu

5、rrentAmplifierHighpowerACCurrentAmplifier•DSPbasedcontrolplatform•HihXHighX-YiYposititiioningaccuracyoff+//-1mm•Resolutionof0.2mmW/HASSY•changeover•·Fullyprogrammableindexer&tracks·Fullyprogrammableindexer&tracks•·Motorizedwindowclampwithsoftclosefeature•·Outputindexerwit

6、hleadframejamprotectionfeature•ToollessconversionwindowclampsandtopplateenablesfastdeviceEagleMACHINESPECIFICATIONS(I)•BondingSystem•BdBondiiMtngMethhdodÎThermosonii(TS)c(TS)•BQMModeÎConstantCurrent,Voltage,PowerandNormal(Programmable)•LoopTypeÎNormal,Low,Square&J•XYResol

7、utionÎ0.2um•ZResolution(capillarytravellingmotion)Î2.5um•FinePitchCapabilityÎ35mmpitch@0.6milwire•NfNo.ofBdBondiiWngWiiresÎupt1000to1000•ProgramStorageÎ1000programsonHardDisk•MultimodeTransducerSystemMultimodeTransducerSystemÎProgrammableprofile,controlandvibrationmodesEa

8、gleMACHINESPECIFICATIONS(II)•VisionSystem•PatternRecognitionTimeÎ70ms/point•PatternRecognitionAc

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