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1、Vol.3,No.12ModernAppliedScienceTheQualityTestofWireBondingCaiyuanWangSchoolofMechanical&ElectronicEngineeringTianjinPolytechnicUniversityTianjin300160,ChinaE-mail:llwinnie@126.com.cnRongluSunSchoolofMechanical&ElectronicEngineeringAdvancedMechatronicsEq
2、uipmentTechnologyTianjinAreaMajorLaboratoryTianjin300160,ChinaE-mail:rlsun@tjpu.edu.cnAbstractThereliabilityoftheICchipduringperformanceofitsfunctioninanyapplicationisverymuchdependantonthequalityofthewirebondinterconnection.Ifthequalityofthewirebondint
3、erconnectionispoorandnotconsistent,ithasasignificantimpactonthereliabilityanddependabilityofthedevice.Thequalityofawirebondisdeterminedbythestrengthoftheinterfacesbetweenthebondwireandthebondpadaswellasthebondwireandtheleadfinger.Inthisarticle,wediscuss
4、indetailestablishedmethodologiessuchasbondpulltest,bondsheartest,visualinspectionandsomespecialtestofquality.Keywords:Wirebonding,Qualitytest,Failuremodes1.IntroductionToday,mostofthecriticalapplicationslikehighperformancecomputersandindustrialsystemsar
5、econtrolledbymicrochipswhichhavewirebondinterconnections.ThereliabilityoftheICchipduringperformanceofitsfunctioninanyapplication,beitinanautomobile,spaceshuttleorapersonalcomputer,isverymuchdependantonthequalityofthewirebondinterconnection.Ifthequalityo
6、fthewirebondinterconnectionispoorandnotconsistent,ithasasignificantimpactnotonlyonthereliabilityanddependabilityofthedevice,butalsohasahugeeconomicimpact.Therefore,qualityassuranceofthewirebondisofutmostimportanceintheICassemblyworkflow.2.TheBondPullTes
7、tThebondpulltestisthemostwidelyusedtechniquefortheevaluationandcontrolofwirebondquality.Thistechniqueisalsousedforwirebondingprocesscontrolandprocessoptimizationduringassemblymanufacturing.Thebondpulltestinvolvesplacingahookunderthewireandapplyinganorma
8、lupwardforceandthewireispulledtillitfails,asisshowninfigure1.Duringbondpulltest,ifaballliftfailureorweldliftfailureoccursevenatveryhighpullvalue,stillitisunacceptableandthebondisconsideredofpoorbondquality.Incaseofsuchfailuresthe
