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1、DevelopmentsinCopperWireBondingLindaC.MatthewSeniorAnalystTechSearchInternational,Inc.www.techsearchinc.com©2011TechSearchInternational,Inc.IMAPSaz5.12Overview•Marketadoption–Drivers–Challenges–Growthincopperwirebonding–Marketsandwiretypes•Trendsandoutlook–Reliabilitystudies–
2、Capillaryproperties–Capillarylifetime–Roadmaps©2011TechSearchInternational,Inc.IMAPSaz5.12DriversforCuWireBonding•Cost,costandcost•Goldpricecontinuestoincrease:$1,515.17/ozon2011-05-04•Copper:$4.15/lb•Earlyadoptionforpowerdevices–electricalandthermalpropertiesSource:LondonGol
3、dMarketFixing,Ltd.©2011TechSearchInternational,Inc.IMAPSaz5.12ReducedIntermetallicGrowthSource:RenesasElectronicsCorp.Slowintermetallicgrowthparticularlybeneficialforautomotiveapplications.©2011TechSearchInternational,Inc.IMAPSaz5.12QFNAssemblyPriceTrendsSource:TechSearchInte
4、rnational,Inc©2011TechSearchInternational,Inc.IMAPSaz5.12ChallengesofCuWireBonding•Mechanicalproperties:Cuhardnesscausespadsplash,damagetounderlyingstructures•Chemicalproperties:oxidationrequiresinertenvironment,interactionwithmoldcompounds•Equipment,process,materialchanges–C
5、apillaries–InertgasatEFO–Moldcompound,padmetallurgy•Throughputandyield–Capillarylifetime–CapillaryMTBA©2011TechSearchInternational,Inc.IMAPSaz5.12MarketAdoption•Majorcontractassemblyhousesareincreasingpurchasesofcopperwirebonders•SEMIsurveyreports72%ofcompaniesareconsiderings
6、witchingnewproductstocopperwire•Amkorinproductionfor5years,with>60customersandnearly300devicesincluding65and45nmlow-k,leadframeandlaminate.•Altera,Carsem,Freescale,Infineon,andTIpresentedpapersontheirCuwirebondprogramsattheIEMTConferenceinMalaysia•Japanesecompaniesstartingtoa
7、doptCuwire.Fujitsuneedstoconfirmmanufacturingthroughputandstablebondquality•SomecompaniesarestillcalculatingthetotalcostoftheconversionofCu,andconversionwilldependonadditionalsiliconcostaswellasthecostofre-qualification©2011TechSearchInternational,Inc.IMAPSaz5.12GrowthinCoppe
8、rWireBonding•Cuwirebondshipmentsincreasedfrom1.6%ofallwireshipmentsi
