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1、WireBondinginMicroelectronicsAbouttheAuthorGeorgeG.HarmanisaretiredFellowoftheNationalInstituteofStandardsandTechnology(NIST).HehasaBSinindustrialphysicsfromVirginiaPolytechnicInstitute&StateUniversityandanMSinphysicsfromtheUniversityofMaryland(1959).Harmanisafo
2、rmerPresidentofIMAPS(1995–1996)andChairoftheIEEECPMTFellowCommittee(1988–2002).HeisalifefellowofbothIMAPSandoftheIEEE.Hehasheldmanyotherelectedandappointedpositionsinthosesocieties,andisamemberoftheITRSRoadmapCommitteeforAssemblyandPackaging(formorethan10years).
3、Heiswidelyconsideredtobetheworld’sforemostauthorityonwirebonding.Harmanhaspublishedmorethan60papers,3booksonwirebonding(the3editionsofWireBondinginMicroelectronics),8bookchapters,4patents,andhasgivenabout100,8-hour,shortcoursesonwirebondingaroundtheworld(overthe
4、past30years).Hehasreceivednumerousawards,bothdomesticallyandinternationally.HismostrecentweretheIMAPS“LifetimeAchievementAward”(2006)andtheIEEE“FieldAwardforComponents,Packaging,andManufacturingTechnology”(2009).WireBondinginMicroelectronicsGeorgeHarmanThirdEdit
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