盲埋孔制作课件.ppt

《盲埋孔制作课件.ppt》由会员上传分享，免费在线阅读，更多相关内容在教育资源-天天文库。

1、WWEIIVHIntroductionUPDATEDONFEB.,14,2000徐振連Micro-viasplacedinsolder,-orbondpadsNOFANOUTPACKAINGDENSITYFANOUTCONVENTIONALPACKAINGDENSITY0盲埋孔(IVH)課程講授大綱主題(Topics)全通孔之缺點封裝趨勢(PackagesTrends)“ViaInPad”之優點盲埋孔(Blind/BuriedVias)之優點孔形成之製作方式(MethodstoGenerateVias)盲埋孔之選擇盲埋孔之製作

2、實例盲埋孔之設計準則及製程能力Q&A(問題與回答)1盲埋孔(IVH)製程講授大綱主題(Topics)1.盲孔板製作sop2.典型盲孔板與鴛鴦板製程比較3.底片管制4.內層製作注意事項5.壓合離型紙評估6.鑽孔板彎翹處理方式(各製程)7.尺寸變化製程管制方式8.主要報廢項目數據9.Q&A(問題與回答)2全通孔會破壞多層板內在電壓層的完整性，使電容蒙受損失增加雜訊ThroughViaHoleDisadvantage(全通孔之缺點)爭奪零件組裝所需的面積。密集組裝迫使通孔孔徑愈來愈小，成本也愈來愈貴。妨礙多層板內在訊號層的佈線面積。3

3、PackageTypeLeadPitchPlacementAccuracymm±mm(%)QFP0.40.04(10%)QFP0.50.075(15%)QFP0.650.13(20%)CSP/μBGA0.50.15(30%)BGA1.00.4(40%)BGA1.270.635(50%)Package/AssemblyInteractionsComponentPlacement4TypeAreaQFP900mm2100%TAB400mm244%COB225mm225%CSP115mm213%FlipChip100mm211%30mm20mm

4、15mm10mmPackagesTrends5Advantage“ViaInPad”-RoutabilityOldway(fanout)ViainPadIncreaseRoutingDensity6Advantage“ViaInPad”-Routability7ReducelayercountReduceboardarea;increasepackagingdensityReduceweightandsizeBlind/BuriedViasAdvantages8100milCURRENTLandDia.0.025”ViaDia.0.0

5、14”LandPitch0.020”NEXTGENERATIONLandDia.0.012”ViaDia.0.005”LandPitch0.0125”100milCurrentthroughholeandblindviacomparetonext-generationblindvias9MechanicalDrill(傳統機械式鑽孔)LaserAblation(雷射燒融法)PhotoDefined(感光成像法)MethodstoGenerateViasPlasma(電漿法)10Buried-viabetweenlayer-pai

6、rs-drill&plateinnerlayerpriortolaminationBlindandBuriedViasFabricationBuried-viaconnectingmanylayers-fabricatemultilayersub-assemblies-drill,plate,pattern,&laminatesub-assemblies11BlindandBuriedViasFabricationBlind-via:option1(Lamination)-likeburied-viaexceptvialayeronou

7、tside-viaregistration&finelineformationdifficultBlind-via:option2(Build-up)-laminate,coat,formblindhole,pattern-mayberepeatedformultiplelayers-blindholeplatingdifficult12AVarietyofSubstratesMayBeUsedCopperCladLaminate(CCL)AdvancedDielectric(PID,PDD……)SubstratesforBlinda

8、ndBuriedViasResinCoatedCopper(RCC)ThermalCurableDielectric(TCD)13BH:ByLaserDrillingBLIN