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1、盲埋孔板制作案例细节描术（Detaildescriptionofblindholeplatefabrication）Ablindholeplate,withaminimumwidthof0.12mm,aminimumapertureof0.25mm,andafinishedboardthicknessof1.6mm.ThisboardisalongdistanceinterphoneboardexportedtotheUnitedStatesafterinstallation.Intheblindhole
2、productionandprocessingshouldbeacertainrepresentation.First,thelinerelationshipofthismodelboard:Thisisasixboard,theboardofeachlayeroflinecorrelationisrelativelycomplexofawalkietalkieboard.Thefollowingrelationbetweeneachlayer:thefirst,secondlayerconnected.
3、Thereisadrillfile,whichisequivalenttomakingadoublesidedboardatthetimeofmaking.Coreboardrequirements:0.35mm,0.5OZ,fourth,fifthlayersofcopperfoil;firstinnerlayerasinnerlayerthird,sixthlayer.Coreboardrequirements:0.3mm,0.5OZ,third,sixthlayersofcopperfoil;the
4、reisafile,theequivalentofthirdtosixthlayerisafourlayerlineconnectivity.Thethicknessofthethird,sixthlayeris0.6mm,andthelaminatedcopperfoilis0.5OZ.Thefirst,sixthlayerofafile,includingcomponentsurfaceandweldingsurfaceconnectivity.Theminimuminnerdiameterofthe
5、innerlayeris0.3mm,theminimumlinewidthis0.125mm,andtheouterminimumapertureis0.25mm(referringtotheproductaperture),andtheminimumwidthis0.125mm.Deliveryis1*4,andonlyfullyqualifiedboarddeliveryisaccepted.Two,theprocessneedstocontrolthelinksandprocesses:Thecon
6、trolpointsthatneedtobenotedarerequiredtocontrolthecontrolprocessesThethreedrillingmustensurethateachdrillholeonce,andensurethattheassociatedlinescorrectline.Engineeringdrillingdesigndocuments,drillingproceduresThetwolaminationguaranteestheinterlayeralignm
7、entofeachlayer.Besidestheengineeringdesign,thegraphictransferprocessisalsocontrolledThreegraphicstransfer,shouldcontrolthefilmexpansioncoefficient,engineeringpremajor,graphicstransferprocessWhentheblindholeislaminated,theouterlayershouldbefilledwithglue,b
8、utitdoesnotpollutethesurfacecopper.Laminatingprocess,PTHprocess,etchingprocessWhentheholeislaminated,theflowofglueshouldbeenoughtoensurethefillingoftheholeissmooth.LaminatingprocessUneventhicknessofthedielectriclaye
