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ID:40047630
大小:736.30 KB
页数:154页
时间:2019-07-18
《AEC-Q100-F-Stress Test Qualification for Integrated Circuits》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、AEC-Q100-Rev-FJuly18,2003STRESSTESTQUALIFICATIONFORINTEGRATEDCIRCUITSAutomotiveElectronicsCouncilComponentTechnicalCommitteeAEC-Q100-REV-FJuly18,2003AutomotiveElectronicsCouncilComponentTechnicalCommitteeTABLEOFCONTENTSAEC-Q100StressTestQualificationforIntegratedCircuitsAppendix1:Definitio
2、nofaQualificationFamilyAppendix2:Q100CertificationofDesign,ConstructionandQualificationAppendix3:PlasticPackageOpeningforWireBondTestingAppendix4:MinimumRequirementsforQualificationPlansandResultsAppendix5:PartDesignCriteriatoDetermineNeedforEMCTestingAttachmentsAEC-Q100-001:WIREBONDSHEART
3、ESTAEC-Q100-002:HUMANBODYMODEL(HBM)ELECTROSTATICDISCHARGE(ESD)TESTAEC-Q100-003:MACHINEMODEL(MM)ELECTROSTATICDISCHARGE(ESD)TESTAEC-Q100-004:ICLATCH-UPTESTAEC-Q100-005:NONVOLATILEMEMORYWRITE/ERASEENDURANCE,DATARETENTION,ANDOPERATIONALLIFETESTAEC-Q100-006:ELECTRO-THERMALLYINDUCEDPARASITICGATE
4、LEAKAGE(GL)TESTAEC-Q100-007:FAULTSIMULATIONANDTESTGRADINGAEC-Q100-008:EARLYLIFEFAILURERATE(ELFR)AEC-Q100-009:ELECTRICALDISTRIBUTIONASSESSMENTAEC-Q100-010:SOLDERBALLSHEARTESTAEC-Q100-011:CHARGEDDEVICEMODEL(CDM)ELECTROSTATICDISCHARGE(ESD)TESTAEC-Q100-REV-FJuly18,2003AutomotiveElectronicsCoun
5、cilComponentTechnicalCommitteeAcknowledgmentAnydocumentinvolvingacomplextechnologybringstogetherexperienceandskillsfrommanysources.TheAutomotiveElectronicsCounselwouldespeciallyliketorecognizethefollowingsignificantcontributorstotherevisionofthisdocument:MajdiMortazaviDaimlerChryslerBrianJ
6、endroDaimlerChryslerRobertV.KnoellVisteonCorporationDetlefGriessmanDelphiDelcoElectronicsSystemsMarkA.KellyDelphiDelcoElectronicsSystemsGeraldE.ServaisDelphiDelcoElectronicsSystems-RetiredNickLycoudesMotorolaJeffParkerInternationalRectifierMarkGabrielleONSemiconductorWilhemMayerContiTemicJ
7、ohnTimmsMotorolaACESCraigNelsonCirrusLogicXinMiaoZhaoCirrusLogicKenBerryHitachiWernerKanertInfineonDonPeckoXilinxAEC-Q100-REV-FJuly18,2003AutomotiveElectronicsCouncilComponentTechnicalCommitteeSTRESSTESTQUALIFICATIONFORPACKAGEDINTEGRATEDCIRCUITSTextenhancement
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