BONDING OF SILICON TO NONSTANDARDBONDING OF SILICON TO NONSTANDARD硅与非标准规范键合 基质.pdf

BONDING OF SILICON TO NONSTANDARDBONDING OF SILICON TO NONSTANDARD硅与非标准规范键合 基质.pdf

ID:51096165

大小:377.04 KB

页数:12页

时间:2020-03-19

BONDING OF SILICON TO NONSTANDARDBONDING OF SILICON TO NONSTANDARD硅与非标准规范键合 基质.pdf_第1页
BONDING OF SILICON TO NONSTANDARDBONDING OF SILICON TO NONSTANDARD硅与非标准规范键合 基质.pdf_第2页
BONDING OF SILICON TO NONSTANDARDBONDING OF SILICON TO NONSTANDARD硅与非标准规范键合 基质.pdf_第3页
BONDING OF SILICON TO NONSTANDARDBONDING OF SILICON TO NONSTANDARD硅与非标准规范键合 基质.pdf_第4页
BONDING OF SILICON TO NONSTANDARDBONDING OF SILICON TO NONSTANDARD硅与非标准规范键合 基质.pdf_第5页
资源描述:

《BONDING OF SILICON TO NONSTANDARDBONDING OF SILICON TO NONSTANDARD硅与非标准规范键合 基质.pdf》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库

1、BONDINGOFSILICONTONON-STANDARDSUBSTRATESNorthernIrelandSemiconductorResearchCentreSchoolofElectricalandElectronicEngineeringOUTLINE•Non-StandardSubstrates–Glass–Sapphire•BondingofSilicontoNon-StandardSubstrates–AnodicBonding(Glass)–ModifiedBondingprocess(Sapphire)NorthernIrelandSemiconductor

2、ResearchCentreSchoolofElectricalandElectronicEngineeringGrindandPolishSOIGrindandPolishtoHandlerequiredthicknessActiveSOIOxidisedhandlesubstrateActivesiliconsubstrateHandleHandleActiveRoomTemperaturebondingfollowedbyhightemperatureannealingNorthernIrelandSemiconductorResearchCentreSchoolofEl

3、ectricalandElectronicEngineeringNon-StandardSubstratesSilicon-on-GlassSilicon-on-Sapphire•Flatpaneldisplay•Improvesthermalandhighfrequency•CapacitivesensorsperformanceofinterconnectscomparedtoSOI.•Solarcells•RadiationHradness•Micromachining•Betterheatdissipationthanquartz•Microwavecctapplica

4、tionsSOSpreviouslyachievedusingepitaxialgrowth-highdensityofdislocations-highleakagecurrentNorthernIrelandSemiconductorResearchCentreSchoolofElectricalandElectronicEngineeringSilicon-On-Glass•AnodicbondingofsiliconandotherSPACECHARGEmaterialstoglass.REGIONANODE------------------------550oC,1

5、000V,1Hr+VEGLASSSUBSTRATE++++++++++++++++++•Problems–ThermalcoefficientMOBILECATHODEofexpansion.ALKALINEIONS.–HighAlkalicontent–LowTemperatureProcessing.NorthernIrelandSemiconductorResearchCentreSchoolofElectricalandElectronicEngineeringSilicon-On-GlassSelectivebondingofsilicontoglassSilicon

6、dioxide/glassbondBondtemperature550oC,BondingVoltage1000V,BondingTime1HrNorthernIrelandSemiconductorResearchCentreSchoolofElectricalandElectronicEngineeringSilicon-On-SapphireDislocationfreeSOScanbeachievedthrough:•WaferbondingTechniques•ActivewaferthinningtechnologyHowever:•Thermalcoef.ofex

7、pansionnotmatchedtoSi.5x10-6/oCforsapphirecomparedto3.6x10-6/oCforSi.•SilicondioxidelayerneededforbondingNorthernIrelandSemiconductorResearchCentreSchoolofElectricalandElectronicEngineeringBondingofSilicontoSapphireIRImageofSi/SapphireIRimageofSiOb

当前文档最多预览五页,下载文档查看全文

此文档下载收益归作者所有

当前文档最多预览五页,下载文档查看全文
温馨提示:
1. 部分包含数学公式或PPT动画的文件,查看预览时可能会显示错乱或异常,文件下载后无此问题,请放心下载。
2. 本文档由用户上传,版权归属用户,天天文库负责整理代发布。如果您对本文档版权有争议请及时联系客服。
3. 下载前请仔细阅读文档内容,确认文档内容符合您的需求后进行下载,若出现内容与标题不符可向本站投诉处理。
4. 下载文档时可能由于网络波动等原因无法下载或下载错误,付费完成后未能成功下载的用户请联系客服处理。