pcb技术与流程课件(经典版）

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1、2021/8/291PCB技術2021/8/292TraditionalMultilayerPatternPlatingProcessD/FStrippingL2L3L4L5Inner-LayerDevelopingPunchingorRoutingF.Q.C.Packing&ShippingInner-LayerD/FL2L3L4L5Inner-LayerEtchingL2L3L4L5PanelCuttingL2L3L4L5RivetL2L3L4L5LaminationL1L6L2L3L4L5Outer-LayerDrilling

2、L1L6L2L3L4L5PatternPlatingL1L6L2L3L4L5Outer-LayerDevelopingL1L6L2L3L4L5Outer-LayerD/FL1L6L2L3L4L5Tin-LeadStrippingL1L6L2L3L4L5SolderMaskPrintL1L6L2L3L4L5HALorEntekL1L6L2L3L4L5Inner-LayerStrippingL2L3L4L5Metalize&PanelPlatingL1L6L2L3L4L5Outer-LayerEtchingL1L6L2L3L4L5Cle

3、aningPost-PunchingL2L3L4L5L1L6L2L3L4L5ElectricalTestingTDRTestingTDRTesting2021/8/293PicturesofPCBduringPatternPlatingProcessCCLAFTERPANELCUTTINGPRE-TREATMENTBEFOREDRY-FILMLAMINATIONDRYFILMLAMINATIONCCLAFTERDRYFILMLAMINATIONCCLAFTEREXPOSURECCLAFTERDEVELOPING2021/8/294C

4、CLAFTERCOPPERETCHINGCCLAFTERD/FSTRIPPINGPOSTPUNCHFORRIVETCCLONA.O.I.CCLAFTERBLACK-OXIDETREATMENTCCLsAFTERRIVET2021/8/295LAYUPOFCCLsANDPREPREGLAYUPOFCCLsANDCOPPERPCBAFTERLAMINATIONWORKINGPANELROUTINGPCBEDGEBEVELINGLOADEROFPCBTHICKNESSMEASUREMENTEQUIPMENT2021/8/296PCBTHI

5、CKNESSMEASUREMENTEQUIPMENTDRILLINGMACHINEPCBAFTEREXTERNALLAYERDRILLINGPTHANDPANELPLATINGLINEPCBAFTERPANELPLATINGEXTERNALLAYERD/F2021/8/297PCBAFTERPATTERNCOPPERANDTINPLATINGPCBAFTERD/FSTRIPPINGPCBAFTERCOPPERETCHINGPCBAFTERTINSTRIPPINGPCBAFTERSOLDERMASKAPPLIEDTDRTesting2

6、021/8/298SURFACETREATMENT(HASL)PANELCNCROUTINGELECTRICTESTINGPACKAGINGSURFACETREATMENT(GOLDFINGER)TDRTesting2021/8/299D/FStrippingL2L3L4L5Inner-LayerDevelopingPunchingorRoutingTraditionalMultilayerTentingProcessPacking&ShippingF.Q.C.ElectricalTestingInner-LayerD/FL2L3L

7、4L5Inner-LayerEtchingL2L3L4L5PanelCuttingL2L3L4L5RivetL2L3L4L5LaminationL1L6L2L3L4L5Outer-LayerDrillingL1L6L2L3L4L5Outer-LayerDevelopingL1L6L2L3L4L5Outer-LayerD/FL1L6L2L3L4L5SolderMaskPrintL1L6L2L3L4L5HALorEntekL1L6L2L3L4L5Inner-LayerStrippingL2L3L4L5Metalize&PanelPlat

8、ingL1L6L2L3L4L5Outer-LayerEtchingCleaningPost-PunchingL2L3L4L5L1L6L2L3L4L5L1L6L2L3L4L5TDRTestingTDRTesting2021/8/2910