effects on signal integrity and radiated emission

effects on signal integrity and radiated emission

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时间:2017-11-25

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1、724IEEETRANSACTIONSONADVANCEDPACKAGING,VOL.28,NO.4,NOVEMBER,2005EffectsonSignalIntegrityandRadiatedEmissionbySplitReferencePlaneonHigh-SpeedMultilayerPrintedCircuitBoardsJingookKim,StudentMember,IEEE,HeeseokLee,andJounghoKim,AssociateMember,IEEEAbstract—Power/groundpartitioninghasbee

2、nusedtosupplymultivoltagelevelsandtoisolatepower/groundnoiseinhigh-speedmultilayerprintedcircuitboards.However,thepartitioningofthepower/groundplanebreaksthecurrentreturnpathofthesignalcurrentthrougheitherthepowerplaneorthegroundplane,whichcausesundesiredeffectssuchassignaldistortion

3、,crosstalk,andra-diation.Tocontrolandsuppresstheseundesiredeffects,weshouldunderstandtheelectromagneticmechanismassociatedwiththem.Inthispaper,themechanismofthereflectionandthetransmissionofthesignalbytheslottedpower/groundplaneiswellunderstoodthroughananalysisofmeasurementsbasedontim

4、e-domainreflec-tometry.Consideringthepropagationofaslotwavethroughtheslotlineonthepower/groundplane,wehavesuccessfullyexplainedthechangesofthetransmittedandreflectedwaveforms.Further-more,wehavenumericallyandexperimentallyinvestigatedtheef-fectsofthepower/groundpartitioningontheradiate

5、demissioninvariousstructures.Finally,itisconfirmedthattheemploymentofastitchingcapacitoronthepower/groundslotsuppressesthesignaldistortionandtheradiatedemissionsignificantly.Whenthesizeandthelocationofthestitchingcapacitoraredesigned,thereFig.1.Signalwaveformdistortion,crosstalk,andele

6、ctromagenticinter-shouldbeacompromisebetweenthenoiseisolationandtheguar-ference(EMI)problemscausedbytheslottedgroundplaneonhigh-speedanteeofthereturncurrentpath,withconsideringtheresonancemultilayerPCB.frequenciesofplanesbythecapacitor.IndexTerms—Electromagneticinterference,noisecoup

7、ling,signalintegrity,slotline,splitplane,stitchingcapacitor.decouplingcapacitorconfiguration,power/groundpartitioning,andpower/groundnoiseisolation.Usually,power/groundpartitioningisusedinhigh-speedI.INTRODUCTIONmultilayerprintedcircuitboards(PCBs)toisolatetheNheterogeneoussystems,tig

8、htintegratio

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