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10 fundamentals of wafer-level packaging.pdf

10 fundamentals of wafer-level packaging.pdf

ID：35160265

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页数：22页

时间：2019-03-20

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1、Source:FUNDAMENTALSOFMICROSYSTEMSPACKAGINGCHAPTER10FUNDAMENTALSOFWAFER-LEVELPACKAGINGDr.PhilGarrouDowChemicalProf.RaoR.TummalaGeorgiaInstituteofTechnology...............................................................................................................

2、..DesignEnvironmentICThermalManagementPackagingMaterialsSingleChipOptoandRFFunctionsDiscretePassivesEncapsulationICReliabilityICAssemblyInspectionPWBMEMSBoardManufacturingAssemblyTestDownloadedfromDigitalEngineeringLibrary@McGraw-Hill(www.digitalengineeringlibrary.

3、com)Copyright©2004TheMcGraw-HillCompanies.Allrightsreserved.AnyuseissubjecttotheTermsofUseasgivenatthewebsite.FUNDAMENTALSOFWAFER-LEVELPACKAGING.................................................................................................................10.1What

4、IsWafer-levelPackaging(WLP)?10.2WhyWafer-levelPackaging?10.3WLPTechnologies10.4WLPReliability10.5Wafer-levelBurn-inandTest10.6SummaryandFutureTrends10.7HomeworkProblems10.8SuggestedReadingCHAPTEROBJECTIVESExplainthereasonsforwafer-levelpackagingCompareandcontrast

5、wafer-levelpackagingwithotherpackagingtechnologiesDescribevariouswafer-leveltechnologiesunderdevelopmentandinuseDescribewafer-levelburn-inandtestmethodologiesProjectthefutureofwafer-levelpackagingCHAPTERINTRODUCTIONTherecenttrendtoportableandwirelessononehand,an

6、dcommoditypricesforcellphonesandPCsontheotherhand,hasbroughtontheneedformuchsmallerICandsystem-levelpackagesthatarealsolowincost.Wafer-levelpackaging,describedinthischapter,addressestheseneedsattheICpackaginglevel.399DownloadedfromDigitalEngineeringLibrary@McGraw-H

7、ill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies.Allrightsreserved.AnyuseissubjecttotheTermsofUseasgivenatthewebsite.FUNDAMENTALSOFWAFER-LEVELPACKAGING400FUNDAMENTALSOFMICROSYSTEMSPACKAGING10.1WHATISWAFER-LEVELPACKAGING?Wafer-levelpackagi

8、ng(WLP)isICpackagingformedatthewaferlevelonthewaferinthewaferfoundry.Thisisincontrasttoconventionalpackagingthatisdoneintwoparts—waferandsingulat

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