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时间:2019-03-14
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1、Source:FUNDAMENTALSOFMICROSYSTEMSPACKAGINGCHAPTER7FUNDAMENTALSOFSINGLECHIPPACKAGINGDr.SundarM.KamathSanminaCorporationProf.RaoR.TummalaGeorgiaInstituteofTechnology.................................................................................................................DesignEnvironm
2、entICThermalManagementPackagingMaterialsSingleChipOptoandRFFunctionsDiscretePassivesEncapsulationICReliabilityICAssemblyInspectionPWBMEMSBoardManufacturingAssemblyTestDownloadedfromDigitalEngineeringLibrary@McGraw-Hill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies
3、.Allrightsreserved.AnyuseissubjecttotheTermsofUseasgivenatthewebsite.FUNDAMENTALSOFSINGLECHIPPACKAGING.................................................................................................................7.1WhatIsaSingleChipPackage?7.2FunctionsofSingleChipPackages7.3TypesofSingl
4、eChipPackages7.4FundamentalsofSingleChipPackaging7.5Materials,Processes,andProperties7.6CharacteristicsofSingleChipPackages7.7SummaryandFutureTrends7.8HomeworkProblems7.9SuggestedReadingCHAPTEROBJECTIVESUnderstandtheneedforasinglechippackageAppreciatethefunctionsofasinglechippackagewithr
5、especttoICneedsCategorizethetypesofsinglechippackagesbasedonmaterials,processesandinterconnectionstoICandprintedwiringboardDiscussmaterialsandprocessesforsinglechippackagesDescribethermal,mechanicalandelectricalcharacteristicsofsinglechippackagesCHAPTERINTRODUCTIONSinglechippackagesaret
6、heICcarrierscalledcomponentsthatgoontosystem-levelboardsinallelectronicsystems.Theyaremadeofplasticsforlowcostandceramicsforhighthermalperformanceandreliability.Therecenttrendtowardportablesystemsisdrivingthesinglechippackagesintoareaarraypackagessuchasballgridarray(BGA)orchipscalepackage(
7、CSP).Thischapterisaboutallsinglechippackages.265DownloadedfromDigitalEngineeringLibrary@McGraw-Hill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies.Allrightsreserved.AnyuseissubjecttotheTermsofUseasgivenatthewebsite.FUNDAMENTALSOFSINGLE
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