08 fundamentals of multichip packaging.pdf

08 fundamentals of multichip packaging.pdf

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时间:2019-03-14

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1、Source:FUNDAMENTALSOFMICROSYSTEMSPACKAGINGCHAPTER8FUNDAMENTALSOFMULTICHIPPACKAGINGProf.HarryK.CharlesJr.JohnsHopkinsUniversityProf.RaoR.TummalaGeorgiaInstituteofTechnology...............................................................................

2、..................................DesignEnvironmentICThermalManagementPackagingMaterialsSingleChipOptoandRFFunctionsDiscretePassivesEncapsulationICReliabilityICAssemblyInspectionPWBMEMSBoardManufacturingAssemblyTestDownloadedfromDigitalEngineeringLib

3、rary@McGraw-Hill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies.Allrightsreserved.AnyuseissubjecttotheTermsofUseasgivenatthewebsite.FUNDAMENTALSOFMULTICHIPPACKAGING.............................................................

4、....................................................8.1WhatAreMultichipModules?8.2MultichipModuleFunctionality8.3MultichipModuleAdvantages8.4MultichipModulesattheSystemLevel8.5TypesofMultichipModuleSubstrates8.6MultichipModuleDesign8.7MultichipModule

5、TechnologyComparisons8.8AlternativestoMultichipModules8.9SummaryandFutureTrends8.10HomeworkProblems8.11SuggestedReadingCHAPTEROBJECTIVESDefinemultichipmodulesandbasicapplicationareasDescribemultichipmoduletypesandconstructionPresentelementsofmultic

6、hipmoduledesignDeveloptradeoffsbetweenmultichipmoduletypesandalternativepackagingmethodsCHAPTERINTRODUCTIONMultichipmodules(MCMs)havebecomeamajorthrustinelectronicpackagingtech-nology.Becauseofthehighperformanceanddensityoftheintegratedcircuitspacka

7、gedinmultichipmodules,stringentnewdemandsarebeingplacedonpackagestructures,electricalinterconnects,andsealing(encapsulation)materials.Thischapterpresentsde-tailsofMCMtechnology,includingdifferenttypes,basicdesignrules,fundamentalap-plications,andpack

8、agingalternativestotheMCM.Thin-filmMCMsoffergreatpromiseforextremelyhigh-performance(density)packagingatverylowcost.297DownloadedfromDigitalEngineeringLibrary@McGraw-Hill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies.Allright

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