欢迎来到天天文库
浏览记录
ID:34931721
大小:728.56 KB
页数:46页
时间:2019-03-14
《08 fundamentals of multichip packaging.pdf》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、Source:FUNDAMENTALSOFMICROSYSTEMSPACKAGINGCHAPTER8FUNDAMENTALSOFMULTICHIPPACKAGINGProf.HarryK.CharlesJr.JohnsHopkinsUniversityProf.RaoR.TummalaGeorgiaInstituteofTechnology...............................................................................
2、..................................DesignEnvironmentICThermalManagementPackagingMaterialsSingleChipOptoandRFFunctionsDiscretePassivesEncapsulationICReliabilityICAssemblyInspectionPWBMEMSBoardManufacturingAssemblyTestDownloadedfromDigitalEngineeringLib
3、rary@McGraw-Hill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies.Allrightsreserved.AnyuseissubjecttotheTermsofUseasgivenatthewebsite.FUNDAMENTALSOFMULTICHIPPACKAGING.............................................................
4、....................................................8.1WhatAreMultichipModules?8.2MultichipModuleFunctionality8.3MultichipModuleAdvantages8.4MultichipModulesattheSystemLevel8.5TypesofMultichipModuleSubstrates8.6MultichipModuleDesign8.7MultichipModule
5、TechnologyComparisons8.8AlternativestoMultichipModules8.9SummaryandFutureTrends8.10HomeworkProblems8.11SuggestedReadingCHAPTEROBJECTIVESDefinemultichipmodulesandbasicapplicationareasDescribemultichipmoduletypesandconstructionPresentelementsofmultic
6、hipmoduledesignDeveloptradeoffsbetweenmultichipmoduletypesandalternativepackagingmethodsCHAPTERINTRODUCTIONMultichipmodules(MCMs)havebecomeamajorthrustinelectronicpackagingtech-nology.Becauseofthehighperformanceanddensityoftheintegratedcircuitspacka
7、gedinmultichipmodules,stringentnewdemandsarebeingplacedonpackagestructures,electricalinterconnects,andsealing(encapsulation)materials.Thischapterpresentsde-tailsofMCMtechnology,includingdifferenttypes,basicdesignrules,fundamentalap-plications,andpack
8、agingalternativestotheMCM.Thin-filmMCMsoffergreatpromiseforextremelyhigh-performance(density)packagingatverylowcost.297DownloadedfromDigitalEngineeringLibrary@McGraw-Hill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies.Allright
此文档下载收益归作者所有