01 introduction to microsystems packaging.pdf

01 introduction to microsystems packaging.pdf

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时间:2019-03-03

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1、Source:FUNDAMENTALSOFMICROSYSTEMSPACKAGINGUNITCONVERSIONFACTORSTemperatureKC273C1.8(F32)RF460Length1m1010A˚3.28ft39.4inMass1kg2.2lbmForce1N1kg-m/s20.225lbfPressure(stress)1P1N/m21.45104psiEnergy1J1W-s1N-m1V-C1J0.239cal6.241018eVCurrent

2、1A1C/s1V/CONSTANTSAvogadro’sNumber6.021023mole1GasConstant,R8.314J/(mole-K)Boltzmann’sconstant,k8.62105eV/KPlanck’sconstant,h6.631033J-sSpeedoflightinavacuum,c3108m/sElectroncharge,q1.61018CSIPREFIXESgiga,G109mega,M106kilo,k103centi,c102milli,m103m

3、icro,106nano,n109DownloadedfromDigitalEngineeringLibrary@McGraw-Hill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies.Allrightsreserved.AnyuseissubjecttotheTermsofUseasgivenatthewebsite.Source:FUNDAMENTALSOFMICROSYSTEMSPACKAGINGCHAPTER1

4、INTRODUCTIONTOMICROSYSTEMSPACKAGINGProf.RaoR.TummalaGeorgiaInstituteofTechnology.................................................................................................................DesignEnvironmentICThermalManagementPackagingMaterialsSingleChipOptoa

5、ndRFFunctionsDiscretePassivesEncapsulationICReliabilityICAssemblyInspectionPWBMEMSBoardManufacturingAssemblyTestDownloadedfromDigitalEngineeringLibrary@McGraw-Hill(www.digitalengineeringlibrary.com)Copyright©2004TheMcGraw-HillCompanies.Allrightsreserved.Anyuseis

6、subjecttotheTermsofUseasgivenatthewebsite.INTRODUCTIONTOMICROSYSTEMSPACKAGING.................................................................................................................1.1WhatAreMicrosystems?1.2MicrosystemTechnologies1.3WhatIsMicrosystemsPa

7、ckaging(MSP)?1.4WhyIsMicrosystemsPackagingImportant?1.5System-LevelMicrosystemsTechnologies1.6WhatisExpectedofYouasaMicrosystemsEngineer?1.7SummaryandFutureTrends1.8WhoInventedMicrosystemsandPackagingTechnologies?1.9HomeworkProblems1.10SuggestedReadingCHAPTEROBJ

8、ECTIVESIntroducetheconceptofMicrosystemsPresentMicrosystemsbuildingblocktechnologiestocontainMicroelectronics,Photonics,MEMS,andRF/WirelessDescribetheroleofPackagi

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