资源描述：
《聚酰亚胺模塑粉的制备和性能研究》由会员上传分享，免费在线阅读，更多相关内容在学术论文-天天文库。
1、分类号：密级：UDC：编号：河北工业大学硕士学位论文聚酰亚胺模塑粉的制备和性能研究论文作者：张静学生类别：全日制学科门类：工学学科专业：化学工程（专业学位）指导教师：李彦涛、肖继君职称：正高工、教授DissertationSubmittedtoHebeiUniversityofTechnologyforTheMasterDegreeofChemicalEngineeringPREPARATIONANDPERFORMANCEOFPOLYIMIDEMOULDINGPOWDERbyZhangJingSupervisor:Prof.LiYantaoMay2016摘要聚酰亚胺（PI）模塑
2、粉可以通过模压成型制备高性能特种工程塑料制品，由于其具有良好的耐热性能和力学性能，所以具有广泛用途。现今，已经商品化的聚酰亚胺模塑粉大多采用具有对称结构的芳香二酐或者二胺作为聚合物的结构单元，然而这类聚酰亚胺模塑粉很难加工，且制品韧性差，在使用过程中易产生内应力，限制了其应用。为了改善聚酰亚胺制品的力学性能，本论文从分子改性的角度出发，采用共聚聚合的方法，分别将联苯四甲酸二酐、二苯醚四甲酸二酐分别引入聚合物分子链中，制备了联苯酐型、单醚酐型和冷成粉型的三种聚酰亚胺模塑粉，通过红外光谱、热重分析、X衍射对模塑粉进行了表征,并且研究了这三种聚酰亚胺模塑粉的模压工艺。通过引入带有柔性
3、链的第三种单体，会导致聚酰亚胺分子链的柔性增加，分子链排列更加规整，从而导致拉伸性能增大。结果表明，制备了具有优异的耐热性和拉伸性能的聚酰亚胺模塑粉，并且上述制备的三种聚酰亚胺模塑粉中，冷成粉型的聚酰亚胺的拉伸性能最好。关键字：聚酰亚胺，共聚，模塑粉，模压，拉伸性能,耐热性能IABSTRACTThehighperformancespecialengineeringplasticcanbemadeofpolyimidebybeingmoulded.Becauseoftheexcellentheatresistanceandmechanicalproperty,thepolyimi
4、dehasbeenusedwidely.Atpresent,alotofcommercialpolyimide,whicharepreparedfromaromaticdianhydrideanddiaminewithsymmetricstructureasthestructureunitofpolymer,aredifficulttoprocess.Meanwhile,themouldedproductshavethepoortoughnessandproduceinteralstressduringtheusingprocess.Therefore,theapplicati
5、onofpolyimideisrestricted.Inordertoimprovethemechanicalpropertyofpolyimideproducts,thetypeofpolyimideincludingbiphenyl,singleetheranhydrideandcoldintopowderwerepreparedwithcopolymerizationbyintroducingbiphenyltetracarboxylicanhydrideandtetracarboxy-diphthalicintothepolymermolecularchain.Thes
6、epowderwerecharacteredbyIR,TGandXRD,aswellastheirmoldingprocesswerestudied.Thethirdmonomerwithflexiblechainwasintroducdintothemolecularchain,whichmakethechainmoreflexibleandneat.Thus,thetensilepropertyincreased.Theexperimentresultsindicatedthatthepolyimidemouldingpowderwithexcellentheat-resi
7、stingandtensilepropertywaspreparedsuccessfully,andthetensilepropertyofcoldintopowdertypepolyimidewasthebest.KEYWORDS:polyimide,copolymerization,mouldingpowder,mold,tensilestrength,heat-resistingII目录第一章绪论·············································
