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ID:32331004
大小:3.25 MB
页数:58页
时间:2019-02-03
《gan+hemt器件模型研究》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、杭州电子科技大学硕士学位论文5.1大信号等效电路模型的基本组成...................................................................305.2常见的大信号模型分析...................................................................................315.2.1Curtice模型......................................................................................
2、......315.2.2Statz模型................................................................................................325.2.3EEHEMT模型........................................................................................335.2.4Angelov模型...............................................................
3、...........................365.3GaNHEMT器件Angelov_GaN模型建立......................................................375.3.1GaNHEMT直流特性拟合...................................................................375.3.2GaNHEMTC-V特性拟合....................................................................405.3.3大信号模型
4、的仿真与验证....................................................................425.4小结...................................................................................................................45第6章基于Angelov模型的InPHEMT模型开发....................................................466.1InPHEMT的Kink效应...
5、................................................................................466.2InPHEMT模型的实现原理.............................................................................476.3InPHEMT模型的建立.....................................................................................486.4InPHEMT模型的验证...
6、..................................................................................526.5小结...................................................................................................................55第7章总结与展望....................................................................................
7、....................567.1总结...................................................................................................................567.2展望...............................................................
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