各种ic封装形式图片大全

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1、各种IC封装形式图片http://www.ic-168.comBGABallGridArrayEBGA680L详细规格LBGA160L详细规格PBGA217LPlasticBallGridArray详细规格SBGA192L详细规格TSBGA680L详细规格QFPQuadFlatPackageTQFP100L详细规格SBGASC-705L详细规格SDIPSIPSingleInlinePackageSOSmallOutlinePackage　CLCC详细规格CNRCommunicationandNetworkingRiserSpecificationRevision1.2详细规格CPGACe

2、ramicPinGridArrayDIPDualInlinePackage详细规格DIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPSOJ32L详细规格SOJSOPEIAJTYPEII14L详细规格SOT220SSOP16L详细规格SSOPTO18TO220FTO220FlatPackHSOP28ITO220ITO3pJLCCLCCLDCCTO247TO264TO3TO5TO52TO71TO72LGALQFPPCDIPPGAPlasticPinGridArray详细规格PLCC详细规格PQFPPSDIPLQFP100L详细规格TO78TO8

3、TO92TO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayMETALQUAD100L详细规格PQFP100L详细规格QFPQuadFlatPackageSOT143SOT220SOT223SOT223uBGAMicroBallGridArray　ZIPZig-ZagInlinePackageBQFP132TEPBGA288LTEPBGA288L详细规格C-BendLead CERQUADCeramicQuadFlatPack详细规格CeramicCas

4、eSOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89LAMINATECSP112LChipScalePackage详细规格GullWingLeads J-STDJ-STDJointIPC/JEDECStandardsJEPJEPJEDECPublicationsJESDJESDJEDECStandardsLLP8La详细规格PCI32bit5VPeripheralComponentInterconnect详细规格PCI64bit3.3VPeripheralComponentInterconnect详细规格Sock

5、et603FosterLAMINATETCSP20LChipScalePackage详细规格TO252TO263/TO268SODIMMSmallOutlineDualIn-lineMemoryModuleSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUPCMCIAPDIPPLCC详细规格PS/2PS/2mouseportpinout详细规格SIMM30SIMM30Pinout详细规格SIMM30SingleIn-lineMemoryModuleSIMM72SIMM72Pinout详细规格SIMM72SingleIn-lineMemoryMo

6、duleSIMM72SingleIn-lineMemoryModuleSLOT1ForintelSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPUPentiumIIPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSOH