《各种ic封装形式》word版

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1、各种IC封装形式图片BGABallGridArrayEBGA680L详细规格LBGA160L详细规格PBGA217LPlasticBallGridArray详细规格SBGA192L详细规格QFPQuadFlatPackageTQFP100L详细规格SBGASC-705L详细规格SDIPSIPSingleInlinePackageSOSmallOutlinePackage　TSBGA680L详细规格CLCC详细规格CNRCommunicationandNetworkingRiserSpecificationRevision

2、1.2详细规格CPGACeramicPinGridArrayDIPDualInlinePackage详细规格DIP-tabDualInlinePackagewithSOJ32L详细规格SOJSOPEIAJTYPEII14L详细规格SOT220SSOP16L详细规格SSOPTO18MetalHeatsinkFBGAFDIPFTO220FlatPackHSOP28ITO220ITO3pTO220TO247TO264TO3TO5TO52TO71JLCCLCCLDCCLGALQFPPCDIPPGAPlasticPinGridAr

3、ray详细规格PLCC详细规格TO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackagePQFPPSDIPLQFP100L详细规格METALQUAD100L详细规格PQFP100L详细规格QFPQuadFlatPackageSOT143SOT220TSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArray　ZIPZig-ZagInlinePackageBQFP132TEPBGA

4、288LTEPBGA288L详细规格SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89C-BendLead CERQUADCeramicQuadFlatPack详细规格CeramicCaseLAMINATECSP112LChipScalePackage详细规格GullWingLeads J-STDJ-STDJointIPC/JEDECStandardsJEPJEPJEDECPublicationsJESDJESDJEDECSOT89

5、Socket603FosterLAMINATETCSP20LChipScalePackage详细规格TO252TO263/TO268SODIMMSmallOutlineDualIn-lineMemoryModuleStandardsLLP8La详细规格PCI32bit5VPeripheralComponentInterconnect详细规格PCI64bit3.3VPeripheralComponentInterconnect详细规格PCMCIAPDIPPLCC详细规格SOCKET370Forintel370pinPGAP

6、entiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPUPS/2PS/2mouseportpinout详细规格SIMM30SIMM30Pinout详细规格SIMM30SingleIn-lineMemoryModuleSIMM72SIMM72Pinout详细规格SIMM72SingleIn-lineMemoryMo

7、duleSIMM72SingleIn-lineMemoryModuleSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSOH