ic封装形式图片介绍

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1、IC封装形式图片介绍BGABallGridArrayEBGA680L球栅阵列，面阵列封装TQFP100LSC-705L方形扁平封装SIPSingleInlineSOPPackageSmallOutlinePackage单列直插封装SOJ32LSOJJ形引线小外形封装SOPEIAJTYPEII14LSOT220小外形封装SSOP16LSSOPTO-18TO-220TO-247TO-264TO3TO52TO52TO71TO72TO78TO8TO92TO93TO99TSSOPorTSOPTSOPIIThinSmallThi

2、nShrinkOutlineOutlinePackagePackageuBGAZIPMicroBallGridZig-ZagInlineArrayPackageuBGAZIPMicroBallGridZig-ZagInlineArrayPackageBQFP132C-BendLeadCERQUADCeramicQuadCeramicCaseFlatPackGullWingTO263/TO268LeadsPBGA217LPlasticBallLBGA160LGridArraySBGA192LTSBGA680LCPGAC

3、LCCCeramicPinGridArrayDIPDualInlineDIP-tabPackageDualInlinePackagewithMetalHeatsink双列直插封装FBGAFDIPFlatPackFTO220HSOP28ITO220ITO3pJLCCLCCLDCCLGALQFPPGAPCDIPPlasticPinGridArrayPLCCPQFP有引线塑料芯片栽体PSDIPLQFP100LMETALQUADPQFP100L100LQFPQuadFlatSOT223PackageSOT223SOT23SO

4、T23/SOT26/SOT323SOT363SOT343SOT523SOT89SOT89LAMINATETCSP20LTO252ChipScalePackageSODIMMSIMM30SmallOutlineSingleIn-lineDualIn-lineMemoryMemoryModuleModuleSOCKET370Forintel370Socket603pinPGAFosterPentiumIII&CeleronCPUPCI64bit3.3VSIMM72PeripheralSingleIn-lineCompon

5、entMemoryInterconnectModuleSOCKETSOCKET7462/SOCKETAForintelForPGAAMDPentium&Athlon&MMXPentiumDuronCPUCPUSLOT1ForintelSLOTAPentiumIIForAMDPentiumIII&AthlonCPUCeleronCPUSIMM72SingleIn-linePCMCIAMemoryModule