《ic封装形式》word版

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1、各种IC封装形式图片http://www.ic-168.comBGABallGridArrayEBGA680L详细规格LBGA160L详细规格PBGA217LPlasticBallGridArray详细规格SBGA192L详细规格TSBGA680L详细规格CLCC详细规格CNRCommunicationandNetworkingRiserSpecificationRevision1.2QFPQuadFlatPackageTQFP100L详细规格SBGASC-705L详细规格SDIPSIPSingleInlinePackageSOSmal

2、lOutlinePackage　SOJ32L详细规格SOJ详细规格CPGACeramicPinGridArrayDIPDualInlinePackage详细规格DIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO220FlatPackHSOP28SOPEIAJTYPEII14L详细规格SOT220SSOP16L详细规格SSOPTO18TO220TO247TO264ITO220ITO3pJLCCLCCLDCCLGALQFPPCDIPTO3TO5TO52TO71TO72TO78TO8TO9

3、2PGAPlasticPinGridArray详细规格PLCC详细规格PQFPPSDIPLQFP100L详细规格METALQUAD100L详细规格PQFP100L详细规格QFPQuadFlatPackageTO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArray　ZIPZig-ZagInlinePackageSOT143SOT220SOT223SOT223SOT2

4、3SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523BQFP132TEPBGA288LTEPBGA288L详细规格C-BendLead CERQUADCeramicQuadFlatPack详细规格CeramicCaseLAMINATECSP112LChipScalePackage详细规格GullWingLeads J-STDJ-STDJointIPC/JEDECStandardsJEPJEPJEDECPublicationsJESDJESDJEDECStandardsLLP8La详细规格PC

5、I32bit5VPeripheralComponentInterconnect详细规格PCI64bitSOT89SOT89Socket603FosterLAMINATETCSP20LChipScalePackage详细规格TO252TO263/TO268SODIMMSmallOutlineDualIn-lineMemoryModuleSOCKET370Forintel370pinPGAPentiumIII&CeleronCPU3.3VPeripheralComponentInterconnect详细规格PCMCIAPDIPPLCC详细规

6、格PS/2PS/2mouseportpinout详细规格SIMM30SIMM30Pinout详细规格SIMM30SingleIn-lineMemoryModuleSIMM72SIMM72Pinout详细规格SIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET

7、462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPUSNAPTKSNAPTKSNAPZPSOH