《ic封装图解》word版

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1、BGABallGridArrayBQFP132EBGA680L详细规格LBGA160L详细规格PBGA217LPlasticBallGridArray详细规格SBGA192L详细规格TEPBGA288LTEPBGA288L详细规格TSBGA680L详细规格AGP3.3VAcceleratedGraphicsPortSpecification2.0详细规格AGPPROAcceleratedGraphicsPortPROSpecification1.01详细规格AGPAcceleratedGraphicsPortSpecification2.0详细规格AMRAudio/ModemRis

2、erAX078AX14C-BendLeadCERQUADCeramicQuadFlatPackCLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2CPGACeramicPinGridArrayCeramicCaseLAMINATECSP112LChipScalePackageDIMM168DIMMDDRDIMM168DualIn-lineMemoryModuleDIMM168DIMM168PinoutDIMM184ForDDRSDRAMDualIn-lineMemoryModuleDIPDualInlinePa

3、ckageDIP-tabDualInlinePackagewithMetalHeatsink EISAExtendedISAFBGAFDIPFTO220FlatPackGullWingLeadsHSOP28ISAIndustryStandardArchitectureITO220ITO3pJLCCLCCLDCCLGALLP8LaLQFPPCDIPPCI32bit5VPeripheralComponentInterconnectPCI64bit3.3VPeripheralComponentInterconnectPCMCIAPDIPPGAPlasticPinGridArrayPLCC

4、PQFPPS/2PS/2mouseportpinoutPSDIPLQFP100LMETALQUAD100LPQFP100LQFPQuadFlatPackageQFPQuadFlatPackageTQFP100LSBGASC-705LSDIPSIMM30SIMM30PinoutSIMM30SingleIn-lineMemoryModuleSIMM72SIMM72PinoutSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSIPSingleInlinePackageSLOT1ForintelPentiumIIP

5、entiumIII&CeleronCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSODIMMSmallOutlineDualIn-lineMemoryModuleSOSmallOutlinePackageSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPUSOHSOJ32LSOJS

6、OPEIAJTYPEII14LSOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89SSOP16LSSOPSocket603FosterLAMINATETCSP20LChipScalePackageTO18TO220TO247TO252TO263/TO268TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutline

7、PackageLAMINATEUCSP32LChipScalePackage详细规格uBGAMicroBallGridArrayuBGAMicroBallGridArrayVLBusVESALocalBusXTBus8bitZIPZig-ZagInlinePackage