印制电路板设计规范——工艺性要求.pdf

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1、印制电路板设计规范工艺性要求目次前言……………………………………………………………………………………………….IV使用说明………………………………………………………………………………………VIII1范围*....................................................................12规范性引用文件***........................................................13定义、符号和缩略语*....

2、..................................................14PCB工艺设计要考虑的基本问题*............................................35印制板基板*..............................................................35.1常用基板性能..............................................................

3、.................................................35.2PCB厚度*....................................................................................................................45.3铜箔厚度*......................................................................

4、...............................................45.4PCB制造技术要求*....................................................................................................56PCB设计基本工艺要求.....................................................56.1PCB制造基本工艺及目前的制造水平*.....

5、...............................................................56.1.1层压多层板工艺...............................................................................................66.1.2BUM（积层法多层板）工艺*...............................................................

6、.........66.2尺寸范围*.....................................................................................................................86.3外形***..............................................................................................................

7、...........86.4传送方向的选择**.......................................................................................................96.5传送边***.....................................................................................................................

8、96.6光学定位基准符号（又称MARK点）***...............................................................96.6.1光学定位基准符号（又称MARK点）分类.................................................96.6.2要布设光学定位基准符号的场合.........................................