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时间:2018-07-28
《印制电路板设计规范(工艺性要求)[]》由会员上传分享,免费在线阅读,更多相关内容在教育资源-天天文库。
1、Q/ZX深圳市中兴通讯股份有限公司企业标准(设计标准)Q/ZX04.100.2-2002印制电路板设计规范——工艺性要求2002-06-28发布2002-07-08实施深圳市中兴通讯股份有限公司发布Q/ZX04.100.2-2002目次前言……………………………………………………………………………………………….IV使用说明…………………………………………………………………………………………VII1范围*....................................................................12引用标
2、准***..............................................................13定义、符号和缩略语*......................................................13.1印制电路PrintedCircuit......................................................................................13.2印制电路板PrintedCircuitBoard(缩写为:PCB)
3、.........................................13.3覆铜箔层压板MetalCladLaminate.........................................................................13.4裸铜覆阻焊工艺SolderMaskonBareCopper(缩写为:SMOBC)...................13.5A面ASide..............................................................
4、................................................13.6B面BSide................................................................................................................13.7波峰焊...................................................................................................
5、........................23.8再流焊...........................................................................................................................23.9SMDSurfaceMountedDevices.................................................................................23.10THCThroug
6、hHoleComponents...............................................................................23.11SOTSmallOutlineTransistor....................................................................................23.12SOPSmallOutlinePackage..........................................
7、.............................................23.13PLCCPlasticLeadedChipCarriers...........................................................................23.14QFPQuadFlatPackage.............................................................................................23.15BG
8、ABallGridArray...............................................
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