一些关于smt的专业术语

《一些关于smt的专业术语》由会员上传分享，免费在线阅读，更多相关内容在工程资料-天天文库。

1、一些关于SMT的专业术语，和大家分享。AI:Auto-Insertion自动插件AQL:acceptablequalitylevel允收水平ATE:automatictestequipment自动测试ATM:atmosphere气;压巳GA:ballgridarray球形矩阵CCD:chargecoupleddevice监视连接组件（摄影机）CLCC:Ceramicleadlesschipcarrier陶瓷引脚载具COB:chip-on-board芯片直I妾贴附在电路板上cps:centipoises（黏度单位）百分之一CSB:chipsca

2、leballgridarray芯片尺寸BGACSP:chipscalepackage芯A尺寸构装CTE:coefficientofthermalexpansion热膨胀系数DIP:dualin-linepackage双A线包装（泛指手插组件）FPT:finepitchtechnology微间距技术FR-4:flame-retardantsubstrate玻璃纤维胶片（用来制作PCB材质）1C:integratecircuit集成电路IR:infra-red红外线Kpa:kilopascals（压力单位）LCCHeadlesschipcarri

3、er引脚式芯片承载器MCM:multi-chipmodule多层芯片模块MELF:metalelectrodeface二极管MQFP:metalizedQFP金属四方扁平封装NEPCON:NationalElectronicPackageandProductionConference国际电子包装及生产会议PBGAplasticballgridarray頰料球形矩阵PCBprintedcircuitboard刷电路板PFCpolymerflipchipPLCCplasticleadlesschipcarrier塑料式冇引脚芯片承载器Polyur

4、ethane聚亚胺酯（刮刀材质）ppmartspermillion指每百万PAD（点）有多少个不良PAD（点）psiounds/inch2磅/英吋2PWBrintedwiringboard电路板QFP:quadflatpackage四边平担封装SIP:singlein-linepackageSIR:surfaceinsulationresistanceSMC:SurfaceMountComponent表面黏着组件SMD:SurfaceMountDevice表面黏着组件SMEMA:SurfaceMountEquipmentManufacture

5、rsAssociation表面黏着设备制造协会SMT:surfacemounttechnology表面黏着技术SOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedpackageSOP:smallout-linepackage小外型封装SOT:smalloutlinetransistor晶体管SPC:statisticalprocesscontrol统计过程控制SSOP:shrinksmalloutlinepackage收缩型小外形封装TAB:tapeautomaticedbon

6、ding带状自动结合TCE:thermalcoefficientofexpansion膨胀（因热）系数Tg:glasstransitiontemperature玻璃转换温度THD:Throughholedevice须穿过洞之组件（贯穿孔）TQFP:tapequadflatpackage带状四方平封装UV:ultraviolet紫外线uBGA:microBGA微小球型矩阵cBGA:ceramicBGA陶瓷球型矩阵PTH:PlatedThruHole导通孔IAInformationAppliance信息家电产品MESH网目OXIDE氧化物FLUX

7、助焊剂LGA（LandGridArry）封装技术LGA封装不需植球，适合轻薄短小产品应用。TCP（TapeCarrierPackage）ACFAnisotropicConductiveFilm异方性导电胶膜制程Soldermask防焊漆SolderingIron烙铁Solderballs锡球SolderSplash锡渣SolderSkips漏焊Throughhole贯穿孑LTouchup补焊Briding橋接（短路）SolderWires焊锡线SolderBars锡棒GreenStrength未M化强度（红胶）TransterPressure

8、转印压力（印刷）ScreenPrinting刮刀式印刷SolderPowder锡颗粒Wettengability润湿能力Viscosity黏度Solderabili