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1、进料检验程序In-ComingComponentInspectionProcedureI.贴片电阻SMDResistor抽样标准:GB2828计数抽样标准一般检查水平II,外观AQL＝0.65,性能0.25SampleStandard:GB2828Samplelevel:II,VisualinspectionAQL=0.65,Capabilitytesting:0.251外观检验Visualinspection1.1检测设备Equipmentused:放大镜Readingglass1.2检测方法及要求Testin
2、gmethodanddemand:1.2.1元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction1.2.2用50倍放大镜检查电阻表面,不得有任何损坏及氧化现象CheckingthesurfaceoftheSMDresistorwith50multiplereadingglass,itmustnothaveanydamageandoxidationonsurface.1.2.3元件表面印字标识应正确,清晰可见.用酒精棉擦拭表
3、面后,不得有损伤,标识仍应清晰可见.Thekite-markmustbecorrectandclearonthesurface.Thekite-markmustbeclearaftersurfacecleaningwithalky.2外形尺寸Figuresizes检测设备Equipmentused:数显游标卡尺Verniercaliper检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesa
4、ccordingasthespecificationwhichofferiedbythemanufacturer,themeasurementsmustbeintherangeonthespecification.3性能检验Capabilitytesting3.2阻值Resistancevalue3.2.3检测设备Equipmentused:LCR数字电桥LCRbridgetester3.2.4检测方法及要求Testingmethodanddemand:将LCR数字电桥设置在测试电阻状态,测量电阻值,所测值不得超
5、过电阻标识误差范围.Setupdigitalelectricbridgeintestingresistor,testingtheresistorwithLCRdigitalelectricbridge,themeasurementsmustbeintherangewhichmarkonthesurfaceoftheresistor.3.3可焊性Solderingtesting表面贴装可焊性,需参见国标检验方法(暂无此检验方法)ThesolderingtestingmethodofSMDpartsthatneedr
6、eferencestandardofChina.(Don’thavethestandardonhandatthemoment)II.贴片电容SMDCapacitor抽样标准:GB2828计数抽样标准一般检查水平II,外观AQL＝0.65,性能0.25SampleStandard:GB2828Samplelevel:II,VisualinspectionAQL=0.65,Capabilitytesting:0.251.外观检验Visualinspection1.1检测设备Equipmentused:放大镜Readi
7、ngglass检测方法及要求Testingmethodanddemand:1.2.1元件包装标识必须与实际产品一致Thekite-markonpackagethatmustbeaccordingwiththeproduction1.2.2用50倍放大镜检查电阻表面,不得有任何损坏及氧化现象CheckingthesurfaceoftheSMDcapacitorwith50multiplereadingglass,itmustnothaveanydamageandoxidationonsurface2.外形尺寸Fig
8、uresizes:1.1检测设备Equipmentused:数显游标卡尺Verniercaliper1.2检测方法及要求Testingmethodanddemand:根据厂商提供的规格说明书对元件尺寸进行测量,所测值不得超过规格书中规定的误差范围.Measuringthesizesaccordingasthespecificationwhichofferiedbythem
