欢迎来到天天文库
浏览记录
ID:62073270
大小:1.32 MB
页数:120页
时间:2021-04-14
《最新PCB词典21746[指南]课件PPT.ppt》由会员上传分享,免费在线阅读,更多相关内容在教育资源-天天文库。
1、PCB词典21746[指南]流程圖PCBMfg.FLOWCHARTUPDATED:1999,09,01多層板內層流程(INNERLAYERPRODUCT)多次埋孔MultipleBuriedVia徐振連JOHNNYHSU顧客(CUSTOMER)工程製前(FRONT-ENDDEP.)裁板(LAMINATESHEAR)內層乾膜(INNERLAYERIMAGE)預疊板及疊板(LAY-UP)通孔電鍍(P.T.H.)液態防焊(LIQUIDS/M)外觀檢查(VISUALINSPECTION)成型(FINALSHAPING)業務(SALESDEPART
2、MENT)生產管理(P&MCONTROL)蝕銅(I/LETCHING)鑽孔(PTHDRILLING)壓合(LAMINATION)外層乾膜(OUTERLAYERIMAGE)二次銅及錫鉛電鍍(PATTERNPLATING)蝕銅(O/LETCHING)檢查(INSPECTION)噴錫(HOTAIRLEVELING)電測(ELECTRICALTEST)出貨前檢查(O.Q.C.)包裝出貨(PACKING&SHIPPING)曝光(EXPOSURE)壓膜(LAMINATION)前處理(PRELIMINARYTREATMENT)顯影(DEVELOPIG)
3、蝕銅(ETCHING)去膜(STRIPPING)黑化處理(BLACKOXIDE)烘烤(BAKING)預疊板及疊板(LAY-UP)壓合(LAMINATION)後處理(POSTTREATMENT)曝光(EXPOSURE)壓膜(LAMINATION)二次銅電鍍(PATTERNPLATING)錫鉛電鍍(T/LPLATING)去膜(STRIPPING)蝕銅(ETCHING)剝錫鉛(T/LSTRIPPING)塗佈印刷(S/MCOATING)預乾燥(PRE-CURE)曝光(EXPOSURE)顯影(DEVELOPING)後烘烤(POSTCURE)MLB全
4、板電鍍(PANELPLATING)銅面防氧化處理O.S.P(EntekCu106A)外層製作(OUTER-LAYER)TENTINGPROCESS鍍金手指(G/FPLATING)鍍化學鎳金(E-lessNi/Au)ForO.S.P.選擇性鍍鎳鍍金(SELECTIVEGOLD)印文字(SCREENLEGEND)網版製作(STENCIL)圖面(DRAWING)工作底片(WORKINGA/W)製作規範(RUNCARD)程式帶(PROGRAM)鑽孔,成型機(D.N.C.)底片(MASTERA/W)磁片,磁帶(DISK,M/T)藍圖(DRAWING
5、)資料傳送(MODEM,FTP)AOI檢查(AOIINSPECTION)除膠渣(DESMER)通孔電鍍(E-LESSCU)DOUBLESIDE前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)全面鍍鎳金(S/GPLATING)雷射鑽孔(LASERABLATION)BlindedVia埋孔鑽孔(I.V.H.DRILLING)埋孔電鍍(I.V.H.PLATING)埋孔(Buriedvia)P1/136缺祟料土行梗驳南箔私品揣政虑羽陵良谢描狮襟利
6、从幻后晋接涯曹由笨满PCB词典21746PCB词典217469/17/20211*ProcessModule說明:A.下料(CutLamination)a-1裁板(SheetsCutting)a-2原物料發料(Panel)(ShearmaterialtoSize)B.鑽孔(Drilling)b-1內鑽(InnerLayerDrilling)b-2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b-4雷射鑽孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔鑽孔(Blind&Bu
7、riedHoleDrilling)C.乾膜製程(PhotoProcess(D/F))c-1前處理(Pretreatment)c-2壓膜(DryFilmLamination)c-3曝光(Exposure)c-4顯影(Developing)c-5蝕銅(Etching)c-6去膜(Stripping)c-7初檢(Touch-up)c-8化學前處理,化學研磨(ChemicalMilling)c-9選擇性浸金壓膜(SelectiveGoldDryFilmLamination)c-10顯影(Developing)c-11去膜(Stripping)D.
8、壓合Laminationd-1黑化(BlackOxideTreatment)d-2微蝕(Microetching)Developing,Etching&Stripping(DES)咋削舷黑吝泰
此文档下载收益归作者所有