SMT常用术语中英文对照.pdf

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1、SMT常用术语&中英文对照微組裝技術﹕MPT/MicroelectronicPackagingechnology混裝技術﹕MixedComponentMountingTechnology封裝﹕Package貼片﹕PickandPlace拆焊﹕Desoldering再流﹕Reflow浸焊﹕DipSoldering拖焊﹕Dragsoldering印制電路﹕PrintedCircuit印制線路﹕PrintedWiring印制電路板﹕printedcircuitboard印制線路板﹕printedwiringboard

2、層壓板﹕laminate覆铜銅薄层壓板﹕copper-cladlaminate基材﹕basematerial成品板﹕productionboard印刷﹕printing導電圖形﹕conductivepattern印制元件﹕printedcomponent單面印制板﹕single-sidedprintedboard雙面印制板﹕double-sidedprintedboard多層印制板﹕multilayerprintedboard電烙鐵﹕Iron熱風嘴﹕hotairreflowingnoozle吸錫帶﹕solder

3、ingwick吸錫器﹕tinextractor焊後檢驗﹕post-solderinginspection目視檢驗﹕visualinspection機器檢驗﹕machineinspection焊點質量﹕solderingjointquality焊電缺陷﹕solderingjontdefect錯焊﹕solderwrong漏焊﹕solderskips虛焊﹕pseudosoldering冷焊﹕coldsoldering橋焊﹕solderbridge脫焊﹕opensoldering焊點剝離﹕solderoff不潤濕焊點﹕

4、solderingnonwetting錫珠﹕solderball拉尖﹕icicle；solderprojection孔洞﹕void焊料爬越﹕solderwicking過熱焊點﹕overheatedsolderconnection不飽和焊點﹕insufficientsolderconnection過量焊點﹕excesssolderconnection助焊劑剩余﹕fluxresidue焊料裂紋﹕soldercrazeing焊角翹起﹕fillet-lifting；lift-offAI:Auto-Insertion自動

5、插件AQL:acceptablequalitylevel允收水準ATE:automatictestequipment自動測試ATM:atmosphere氣壓BGA:ballgridarray球形矩陣CCD:chargecoupleddevice監視連接元件(攝影機)CLCC:Ceramicleadlesschipcarrier陶瓷引腳載具COB:chip-on-board晶片直接貼附在電路板上cps:centipoises(黏度單位)百分之一CSB:chipscaleballgridarray晶片尺寸BGACS

6、P:chipscalepackage晶片尺寸構裝CTE:coefficientofthermalexpansion熱膨脹系數DIP:dualin-linepackage雙內線包裝(泛指手插元件)FPT:finepitchtechnology微間距技術FR-4:flame-retardantsubstrate玻璃纖維膠片(用來製作PCB材質)IC:integratecircuit積體電路IR:infra-red紅外線Kpa:kilopascals(壓力單位)LCC:leadlesschipcarrier引腳式晶片

7、承載器MCM:multi-chipmodule多層晶片模組MELF:metalelectrodeface二極體MQFP:metalizedQFP金屬四方扁平封裝NEPCON:NationalElectronicPackageandProductionConference國際電子包裝及生產會議ppm:partspermillion指每百萬PAD(點)有多少個不良PAD(點)psi:pounds/inch2磅/英吋2PWB:printedwiringboard電路板QFP:quadflatpackage四邊平坦封裝

8、SIP:singlein-linepackageSIR:surfaceinsulationresistance絕緣阻抗SMC:SurfaceMountComponent表面黏著元件SMD:SurfaceMountDevice表面黏著元件SMEMA:SurfaceMountEquipmentManufacturersAssociation表面黏著設備製造協會SMT:surfacemoun