smt术语中英文对照表

《smt术语中英文对照表》由会员上传分享，免费在线阅读，更多相关内容在行业资料-天天文库。

1、AI:Auto-Insertion自动插件AQL:acceptablequalitylevel允收水准ATE:automatictestequipment自动测试ATM:atmosphere气压BGA:ballgridarray球形矩阵CCD:chargecoupleddevice监视连接元件(摄影机)CLCC:Ceramicleadlesschipcarrier陶瓷引脚载具COB:chip-on-board晶片直接贴附在电路板上cps:centipoises(黏度单位)百分之一CSB:chipscaleballgridarray晶片尺寸BGACSP:chipscalepa

2、ckage晶片尺寸构装CTE:coefficientofthermalexpansion热膨胀系数DIP:dualin-linepackage双内线包装(泛指手插元件)FPT:finepitchtechnology微间距技术FR-4:flame-retardantsubstrate玻璃纤维胶片(用来製作PCB材质)IC:integratecircuit积体电路IR:infra-red红外线Kpa:kilopascals(压力单位)LCC:leadlesschipcarrier引脚式晶片承载器MCM:multi-chipmodule多层晶片模组MELF:metalelectr

3、odeface二极体MQFP:metalizedQFP金属四方扁平封装NEPCON:NationalElectronicPackageandProductionConference国际电子包装及生产会议PBGAlasticballgridarray塑胶球形矩阵PCBrintedcircuitboard印刷电路板PFColymerflipchipPLCClasticleadlesschipcarrier塑胶式有引脚晶片承载器Polyurethane聚亚胺酯(刮刀材质)ppmartspermillion指每百万PAD(点)有多少个不良PAD(点)psiounds/inch2磅/

4、英吋2PWBrintedwiringboard电路板QFP:quadflatpackage四边平坦封装SIP:singlein-linepackageSIR:surfaceinsulationresistance绝缘阻抗SMC:SurfaceMountComponent表面黏着元件SMD:SurfaceMountDevice表面黏着元件SMEMA:SurfaceMountEquipmentManufacturersAssociation表面黏着设备製造协会SMT:surfacemounttechnology表面黏着技术SOIC:smalloutlineintegratedc

5、ircuitSOJ:smallout-linej-leadedpackageSOP:smallout-linepackage小外型封装SOT:smalloutlinetransistor电晶体SPC:statisticalprocesscontrol统计过程控制SSOP:shrinksmalloutlinepackage收缩型小外形封装TAB:tapeautomaticedbonding带状自动结合TCE:thermalcoefficientofexpansion膨胀(因热)係数Tg:glasstransitiontemperature玻璃转换温度THD:Throughho

6、ledevice须穿过洞之元件(贯穿孔)TQFP:tapequadflatpackage带状四方平坦封装UV:ultraviolet紫外线uBGA:microBGA微小球型矩阵cBGA:ceramicBGA陶瓷球型矩阵PTH:PlatedThruHole导通孔IAInformationAppliance资讯家电产品MESH网目OXIDE氧化物FLUX助焊剂LGA(LandGridArry)封装技术LGA封装不需植球，适合轻薄短小产品应用。TCP(TapeCarrierPackage)ACFAnisotropicConductiveFilm异方性导电胶膜製程Soldermas

7、k防焊漆SolderingIron烙铁Solderballs锡球SolderSplash锡渣SolderSkips漏焊Throughhole贯穿孔Touchup补焊Briding穚接(短路)SolderWires焊锡线SolderBars锡棒GreenStrength未固化强度(红胶)TransterPressure转印压力(印刷)ScreenPrinting刮刀式印刷SolderPowder锡颗粒Wettengability润湿能力Viscosity黏度Solderability焊锡性Applicability使