具有低表面自由能有机介电薄膜的制备及表征.pdf

《具有低表面自由能有机介电薄膜的制备及表征.pdf》由会员上传分享，免费在线阅读，更多相关内容在行业资料-天天文库。

1、物理化学学报(WuliHuaxueXuebao1JulyActa尸．一Chim．Sin．2011，27(7)，1777—17821777【Article]Ⅵ，、V、V．whxb．pku．edu．cn具有低表面自由能有机介电薄膜的制备及表征刘应辉康志新(华南理工大学机械与汽车工程学院，国家金属材料近净成形工程技术研究中心，广州510640)摘要：通过自主开发的有机镀膜技术在Mg—Mn，Ce镁合金表面制备了具有低表面自由能和较高介电常数的有机纳米薄膜．利用X射线光电子能谱(xps)分析了表面有机镀膜过程的反应机理，借助傅里i】十变换红外

2、(FT．IR)光谱进一‘步确认表面有机膜层的存存，采用接触角测量仪测定了有机薄膜的蒸馏水接触角和表面自山能变化，使用椭圆偏振光谱仪研究了薄膜的厚度，并借助精南阻抗分析仪计价了薄膜的介电性能．有机镀膜后镁合金表面形成了一层纳米级厚度的有机薄膜，接触角从基体的70．8。上升至15O．5。，表面自由能从基体的37．96mJ·m降低到157mJ·m～，镁合金表面从亲水性转变为疏水性：薄膜的厚度和质量随有机镀膜时间延长先增加后有所减小，在镀膜20min时薄膜性能最佳，此时膜重达剑23．5Pg·cm～，膜厚最大为147．48nm，其相对介电常数

3、也达到最大．在1kHz下可达24．922．关键词：有机镀膜：纳米薄膜：疏水：表面自由能：介电薄膜中图分类号：0646PreparationandCharacterizationofaPolymericDielectricFiImwithaLowSurfaceFreeEnergyLIUYing—HuiKANGZhi—XinfNationalEngineeringResearchCenterofNear-Net—ShapeFormingforMetallicMaterials．SchoolofMechanical＆AutomotiveE

4、ngineering,SouthChinaUniversityofTechnology,Guangzhou51064~R．China1Abstract：ApolymericnanOfiImwithalowsurfacefreeenergyandhighdielectricconstantonthesurfaceofaMg-Mn—Cemagnesiumalloywaspreparedbyaself-deVelODedtechniquewhichwasdesignedaspolymerplating．Thereactionmechani

5、smduringpolymerplatingwasanalyzedbyX—rayphotoelectronspectroscopyfXPS)．Thef¨mformedonthemagnesiumalloysurfaceasdeterminedbyFouriertransforminfrared(FT-IR)spectroscopy．Thecontactangleofdistilledwaterandthesurfacefreeenergyofthepolymericfilmweredeterminedusingacontactang

6、lemeter．Thef¨mthicknesswascharacterizedbyspectroscopicellipsometry．ThedielectricpropeRyofthefiImwasevaluatedusingaprecisionimpedanceanalyzer．TheexperimentaIresultsshowthatthenanoscalepolymericf¨mwassuccessfullyformedonthemagnesiumalloysurfaceafterpolymerplating．Thecont

7、actangleofdistilledwaterforthepolymer-platedmagnesiumalloyincreasedto150．5。comparedwith70．8。f0rthesubstrateandthesurfacefreeenergyofthepolymer—platedmagnesiumalloydecreasedto1．57mJ·mfr0m37．96mJ·mf0rthesubstrate．Therefore．thefunctionaIperformancechangedfromhydrophilictO

8、hydrophobic．ThefjImmassandthicknessincreasedwiththepolymer-platingtimebefore20minandthendecreasedslightly．Thef¨mmassa