无铅焊膏印刷模板规范.doc

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1、无铅焊膏印刷模板开口设计推荐规范■宽厚比=开口的宽度(W)/模板的厚度(T)>1.6■面积比=开口面积(LXW)/孔壁的面积[2*(L+W)*T]>0.711．一般印焊膏模板开口尺寸及厚度元件类型PITCH焊盘宽度焊盘长度开口宽度开口长度模板厚度宽度比面积比PLCC1.27mm0.65mm2.0mm0.60mm1.95mm0.15-0.25mm2.3-3.80.88-1.48(50mil)(25.6mil)(78.7mil)(23.6mil)(76.8mil)(5.91-9.84mil)QFP0.635mm0

2、.635mm0.635mm0.635mm0.635mm0.635mm1.7-2.00.71-2.0(25mil)(13.8mil)(59.1mil)(11.8mil)(57.1mil)(5.91-7.5mil)QFP0.50mm0.254-0.33mm1.25mm0.22-0.25mm1.2mm0.125-0.15mm1.7-2.00.69-0.83(20mil)(10-13mil)(49.2mil)(9-10mil)(47.2mil)(4.92-5.91mil)QFP0.40mm0.25mm1.25mm0.

3、2mm1.2mm0.10-0.125mm1.6-2.00.68-0.86(15.7mil)(9.84mil)(49.2mil)(7.87mil)(47.2mil)(3.94-4.92mil)QFP0.30mm0.20mm1.00mm0.15mm0.95mm0.075-0.125mm1.50-2.00.65-0.86(11.8mil)(7.87mil)(39.4mil)(5.91mil)(37.4mil)(2.95-3.94mil)0402 0.50mm0.65mm0.45mm0.6mm0.125-0.15mm

4、 0.84-1.00 (19.7mil)(25.6mil)(17.7mil)(23.6mil)(4.92-5.91mil)0201 0.25mm0.40mm0.23mm0.35mm0.075-0.125mm 0.66-0.89 (9.84mil)(15.7mil)(9.06mil)(13.8mil)(2.95-3.94mil)BGA1.27mmφ0.80mm φ0.75mm 0.15-0.20mm 0.93-1.25(50mil)(31.5mil) (29.5mil) (5.91-7.87mil)UBGA1.

5、00mmφ0.38mm φ0.35mm0.35mm0.115-0.135mm 0.67-0.78(39.4mil)(15.0mm) (13.8mil)(13.8mil)(4.53-5.31mil)UBGA0.50mmφ0.30mm φ0.28mm0.28mm0.075-0.125mm 0.69-0.92(19.7mil)(11.8mm) (11.0mil)(11.0mil)(2.95-3.94mil)FlipChip0.25mm0.12mm0.12mm0.12mm0.12mm0.08-0.10mm 1.0(1

6、0mil)(5mil)(5mil)(5mil)(5mil)(3-4mil)FlipChip0.20mm0.10mm0.10mm0.10mm0.10mm0.05-0.10mm 1.0(8mil)(4mil)(4mil)(4mil)(4mil)(2-4mil)FlipChip0.15mm0.08mm0.08mm0.08mm0.08mm0.025-0.08mm 1.02．Chip件开口修改方案3．IC开口修改方案4．制造方法：一般采用激光切割加电化学抛光（Laser+Electroplish）工艺。如果开口宽厚比和

7、面积比接近门限值，建议采用电铸(Electroform)工艺制造。