SMT专业英语.doc

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1、THT(ThroughHoleTechnology):通孔安装技术SMT(SurfaceMountedTechnology)：表iflj安装技术PTH(PinThroughtheHole)：通孔安装THT(ThroughHoleComponent):通孔插装元件SMB(SurfaceMountPrintedCircuitBoard)：表血安装PCB板SMC(SurfaceMountComponent)：表面安装元件SMD(SurfaceMountDevice)：表面安装器件SMA(SurfaceMountAssembly)：表血安装组件Component：元件Device：器件Asse

2、mbly：组件CTE(coefficicnlofthermalexpansion)：热膨胀系数In-circuittest：在线测试Leadconfiguration：引脚外形Placementequipment：贴装设备Reflowsoldering:冋流焊接Repair：修理Rework：返工Solderability：可焊性Soldermask：阻焊Yield：产出率Packagingdensity：装配密度Chip：片状元件melf：圆柱形元件PCB(Printedcircuitboard)：印刷电路板DIP：双列育•插SIP：单列直插SOT(SmallOutlineTrans

3、istor)：小外形晶体管SOIC(SmalloutlineIC)：小外形集成电路，SOP(SmalloutlinePackage)：小外型封装PLCCCPlasticLeadedChipCarrier)：教型有引脚芯片载体LCCC(LeadlessCeramicChipCarrier)：无引脚陶瓷芯片载体QFP(QuadFlatPackage)：多引脚方形扁平封装BGA(Ballgridarray)球栅歹U阵CSP(ChipScalePackage):芯片规模的封装BareChip：裸芯片Accuracy：精度ATE(Automatedtestequipment)：fl动测试设备AO

4、I(Automaticopticalinspection)：自动光学检查Blindvia：盲孑LBuriedvia：埋孔throughvia：通孔Bridge：锡桥Circuittester：电路测试机CTE(Coefficientofthethermalexpansion):温度膨胀系数Coldsolderjoint：冷知!锡点、Componentdensity：元件密度Copperfoil：铜箔Coppermirrortest：铜镜测试Cure：烘焙固化Cyclerate：循环速率Defect：缺陷Desoldering：卸焊Downtime：停机时间FPT(Fine-pitcht

5、echnology):密脚距技术Flipchip：倒装芯片FCT(Functionaltest)：功能测试Goldenboy：金样ICT(In-circuittest)：在线测试JIT(Just-in-time):刚好准时Leadconfiguration：引脚外形Packagingdensity：装配密度Pick-and-place:拾取■贴装设备Placementequipment：贴装设备Reflowsoldering:冋流焊接Repair：修理Rework:返TSchematic：原理图Solderbump：焊锡球Solderability：可焊性Soldermask：阻焊Ta

6、pe-and-reel：带和盘Tombstoning：元件立起Ultra-fine-pitch：超密脚距Yield：产出率soldermask：阻焊漆silkscreen：丝印面via：导孑LCopperCladLaminates：覆铜箔空压板pastmask：焊膏膜（漏板）soldermask：焊接掩摸（阻焊膜）SoldingPasts：焊锡膏Stencils：模板、漏板、钢板Bridging：搭锡Cursting：发生皮层ExcessivePaste：膏量太多InsufficientPaste：不足PoorTackRetention：粘着力不足Slumping：坍塌Smearing

7、：模糊Dpm（defectspermillion）:百力缺陷率Flexibility：柔性Modularity：模块化ComponentPick-Up：元件拾取ComponentCheck：元件检查ComponentTransport：元件传送PlacementProcedure：元件放置ChamberSystem：炉膛系统Blowholes：吹孔Voids：空洞Movement：移位Misalignment：偏斜Dewetting：缩锡Dul