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时间:2020-01-27
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1、HP-00016-0006-Apr-2010HPStandard016-0GeneralSpecificationforPrinted-CircuitAssemblyandReworkProcessesOwnerKrisTroxelResponsibleGroupGlobalEngineeringServicesDocumentIdentifierHP-00016-00RevisionandDateA,06-Apr-2010AbstractThisstandarddescribescriticaltin
2、-lead(Sn-Pb)andlead-free(Pb-free)printed-circuitassemblyandreworkprocessparameterstogetherwithspecificationsorguidelinesfortheirvalues.ApplicabilityTherequirementsinthisspecificationapplytoallsuppliersofelectronicmanufacturingservices(EMS),contractmanufa
3、cturers(CMs),suppliersoffinishedPCAs,andsuppliersofcompleteelectronicproductstoHP.StatusApproved©Copyright2010Hewlett-PackardDevelopmentCompany,L.P.Thisisanuncontrolledcopywheninprintedform.TableofContents1Purpose2Scope3Limitations4GeneralObligations5Doc
4、umentHierarchy6CriticalPCAIssues6.1PCAQualityandWorkmanshipStandards6.2PCACleanlinessandContamination6.3MechanicalStrain6.4FactoryEnvironment7ComponentandPCBRequirements8CommonAssemblySubprocesses8.1StencilPrint8.2GlueProcesses8.3ComponentPlacement8.4Sol
5、derReflow8.5WaveSolder8.6PCAWash(ForWater-CleanFluxesOnly)8.7De-Panel8.8Press-Fit8.9ProtectiveTape8.10Rework8.11HeatSinkandThermalSolutionAttach8.12In-circuitandFunctionalTest8.13HandlingandShippingPackaging8.14MoistureSensitiveComponentHandlingHPRestric
6、ted1HP-00016-0006-Apr-20108.15EnvironmentRules8.16ElectrostaticDischarge8.17InspectionandX-rayAppendixAMinimumSolderPasteVolumeRequirementsforCoreElectronicsChipsets(CECs)ReferencedDocuments1PurposeThisstandarddescribescriticalprinted-circuitassembly(PCA
7、)andreworkprocessparameters,withspecificationsorguidelinesfortheirvalues.Otherrelevantspecificationsarecited.Thesespecificationsandguidelinesareasupplementtogeneralknowledgeofmanufacturingengineering.Theymaybemodifiedforspecificproductneeds.However,devia
8、tionfromthesespecificationsandstandardsispermittedonlywiththeapprovaloftheresponsibleHPproduct-engineeringgrouporHPGlobalEngineeringServices(GES).2ScopeTherequirementsinthisspecificationapplytoallsuppliersofelectronicmanuf
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