电子组装的IPC标准列表

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1、TermsandDefinitionforInterconnectingandPackagingIPC-T-50GElectronicCircuits电子电路互连与封装的定义和术语TestMethodsManualIPC-TM-650试验方法手册RequirementsforSolderedElectrical&ElectronicAssembliesIPC/EIAJ-STD-001C电气与电子组装件锡焊要求HandbookandGuidetoSupplementJ-STD-001—IncludesAmend

2、ment1IPC-HDBK-001J-STD-001辅助手册及指南及修改说明1AcceptabilityofElectronicAssembliesIPC-A-610D印制板组装件验收条件HandbookandGuidetoIPC-A-610(IncludesIPC-A-610BtoCComparisonIPC-HDBK-610IPC-610手册和指南(包括IPC-A-610B和C的对比)ElectronicAssemblyReferenceSetIPC-EA-100-K电子组装成套手册，包括：IPC/EIA

3、J-STD-001C，IPC-HDBK-001，IPC-A-610C。RequirementsandAcceptanceforCableandWireHarnessAssembliesIPC/WHMA-A-620电缆和引线贴装的要求和验收ImplementationofFlipChipandChipScaleTechnologyIPC/EIAJ-STD-012倒装芯片及芯片级封装技术的应用GuidelinesforChip-on-BoardTechnologyImplementationIPC-SM-784芯

4、片直装技术实施导则SemiconductorDesignStandardforFlipChipApplicationsIPC/EIAJ-STD-026倒装芯片用半导体设计标准MechanicalOutlineStandardforFlipChipandChipSizeConfigurationsJ-STD-027FC（倒装片）和CSP(芯片级封装)的外形轮廓标准PerformanceStandardforConstructionofFlipChipandChipScaleIPC/EIAJ-STD-028Bum

5、ps倒装芯片及芯片级凸块结构的性能标准ImplementationofBallGridArrayandOtherHighDensityTechnologyJ-STD-013球栅阵列(BGA)及其它高密度封装技术的应用DesignandAssemblyProcessImplementationforBGAsIPC-7095球栅阵列的设计与组装过程的实施PerformanceStandardforBallGridArrayBallsIPC/EIAJ-STD-032BGA球形凸点的标准规范Guidelinesfor

6、MultichipModuleTechnologyUtilizationIPC-MC-790多芯片组件技术应用导则CleaningGuidesandHandbookManualIPC-M-108清洗导则和手册UsersGuideforCleanlinessofUnpopulatedPrintedBoardsIPC-5701非密集型印制板清洁应用导则CircuitBoardIonicCleanlinessMeasurement:WhatDoesItTellUs?IPC-TP-1113电路板离子洁净度测量：它告诉

7、我们什么？GuidelinesforCleaningofPrintedBoards&AssembliesIPC-CH-65A印制板及组装件清洗导则PostSolderSolventCleaningHandbookIPC-SC-60A锡焊后溶剂清洗手册PostSolderSemi-aqueousCleaningHandbookIPC-SA-61A锡焊后半水溶剂清洗手册AqueousPostSolderCleaningHandbookIPC-AC-62A锡焊后水溶液清洗手册ElectrochemicalMigra

8、tion:ElectricallyInducedFailuresinPrintedIPC-TR-476ACircuitAssemblies电化学迁移：印制电路组件的电气诱发故障CleaningandCleanlinessTestProgramfor:Phase3--LowSolids,IPC-TR-582FluxesandPastesProcessedinAmbientAirIPC第3阶段非清洗助焊