电子组装的ipc标准全集

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1、IPC-T-50GTermsandDefinitionforInterconnectingandPackagingElectronicCircuits电子电路互连与封装的定义和术语IPC-TM-650TestMethodsManual试验方法手册IPC/EIAJ-STD-001CRequirementsforSolderedElectrical&ElectronicAssemblies电气与电子组装件锡焊要求IPC-HDBK-001HandbookandGuidetoSupplementJ-STD-001—IncludesAmendment1J-STD-001辅助手册及指南及修改说明1IPC-

2、A-610DAcceptabilityofElectronicAssemblies印制板组装件验收条件IPC-HDBK-610HandbookandGuidetoIPC-A-610(IncludesIPC-A-610BtoCComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比)IPC-EA-100-KElectronicAssemblyReferenceSet电子组装成套手册，包括：IPC/EIAJ-STD-001C，IPC-HDBK-001，IPC-A-610C。IPC/WHMA-A-620RequirementsandAcceptanceforCableandW

3、ireHarnessAssemblies电缆和引线贴装的要求和验收IPC/EIAJ-STD-012ImplementationofFlipChipandChipScaleTechnology倒装芯片及芯片级封装技术的应用IPC-SM-784GuidelinesforChip-on-BoardTechnologyImplementation芯片直装技术实施导则IPC/EIAJ-STD-026SemiconductorDesignStandardforFlipChipApplications倒装芯片用半导体设计标准J-STD-027MechanicalOutlineStandardforFlipC

4、hipandChipSizeConfigurationsFC（倒装片）和CSP(芯片级封装)的外形轮廓标准IPC/EIAJ-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps倒装芯片及芯片级凸块结构的性能标准J-STD-013ImplementationofBallGridArrayandOtherHighDensityTechnology球栅阵列(BGA)及其它高密度封装技术的应用IPC-7095DesignandAssemblyProcessImplementationforBGAs球栅阵列的设计与组装过

5、程的实施IPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBallsBGA球形凸点的标准规范IPC-MC-790GuidelinesforMultichipModuleTechnologyUtilization多芯片组件技术应用导则IPC-M-108CleaningGuidesandHandbookManual清洗导则和手册IPC-5701UsersGuideforCleanlinessofUnpopulatedPrintedBoards非密集型印制板清洁应用导则IPC-TP-1113CircuitBoardIonicCleanlinessM

6、easurement:WhatDoesItTellUs?电路板离子洁净度测量：它告诉我们什么？IPC-CH-65AGuidelinesforCleaningofPrintedBoards&Assemblies印制板及组装件清洗导则IPC-SC-60APostSolderSolventCleaningHandbook锡焊后溶剂清洗手册IPC-SA-61APostSolderSemi-aqueousCleaningHandbook锡焊后半水溶剂清洗手册IPC-AC-62AAqueousPostSolderCleaningHandbook锡焊后水溶液清洗手册IPC-TR-476AElectroche

7、micalMigration:ElectricallyInducedFailuresinPrintedCircuitAssemblies电化学迁移：印制电路组件的电气诱发故障IPC-TR-582CleaningandCleanlinessTestProgramfor:Phase3--LowSolids,FluxesandPastesProcessedinAmbientAirIPC第3阶段非清洗助焊