SEMI G45-93 RECOMMENDED PRACTICE FOR FLASH CHARACTERISTICS

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1、SEMIG45-93N/A©SEMI1986,1996RECOMMENDEDPRACTICEFORFLASHCHARACTERISTICSOFTHERMOSETTINGMOLDINGCOMPOUNDS1Scope3.4SteelRuleÑMeasuredin0.25mm(0.010in).Thismethoddescribesaprocedureformeasuringthe3.5HaloLampÑ3´magnification,minimum.ßashingcharacteristicsofsemiconductorgradetrans-3.6Therm

2、ocoupleand/orPyrometerCalibratedÑInfermoldingcompounds.the160¡Ð190¡Crange(calibrationtobecheckedevery6months).2SigniÞcance2.1Theßashingtendencyforsemiconductorgrade4TestConditionsmoldingcompoundsdependsontheinteractionofsev-4.1MoldingCompoundsÑRefrigeratedshipmenteralvariables,inc

3、ludingmoldconditions,processandstorageofsomemoldingcompoundsisnecessary.parameters,moldingcompoundviscosity,andcuringThemoldingcompoundistobeatroomtemperaturecharacteristics.Thistestisnotavalidmethodforpre-beforethecontainerisopened.Caremustbetakentodictingtheßashingperformanceina

4、llmoldtypes.Itispreservetheoriginalmoisturecontent.Thematerialamethodforcomparingßashtendencyandßashingshouldbeinpowderedform,unlessotherwisespeci-typeofdifferentmoldingcompoundswhenevaluatedfied.underaspeciÞcsetofmoldingprocessparameters.4.2FlashTestMoldÑShallbecleanandfreefrom2.

5、2Flashingpresentsproblemswithsubsequentpro-anymoldreleaseagentsorlubricants.Astandardmoldcessingofplasticpackageddevicesaftermolding.Acleaningcompoundcanbeusedtoinsuremoldcleanli-highßashingtendencyincreasesdiewearinthetrimness.andformoperation,mayinterferewithplatingorsol-derdipÞ

6、nishingoperations,andmaypreventgood4.3MoldingConditionscontactforelectricaltest.Thus,reducedtendency4.3.1Thetemperatureofthemoldshallbemeasuredtowardßashingwillimprovetheplasticpackagesub-usingathermocoupleinsertedinthemoldorwithaassemblyoperations.Theinformationfromthistestsurfac

7、epyrometer.Theramshallbekeptatthemoldwillbeofvalueinratingßashperformanceofanytemperature.Moldingtemperatureistobe175¡Cgivencompoundtothatinproductionuse.unlessotherwisespeciÞed.Temperaturemustbemain-tainedwithin±3¡C(±5¡F)ofthespeciÞedtempera-3Apparatusture.3.1Transfermoldingpress

8、withaplatenareasufÞcient4.3.2Thet