SEMI G63-95 TEST METHOD FOR MEASUREMENT OF DIE SHEAR

SEMI G63-95 TEST METHOD FOR MEASUREMENT OF DIE SHEAR

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1、SEMIG63-95N/A©SEMI1995,1996TESTMETHODFORMEASUREMENTOFDIESHEARSTRENGTH1Purpose6EquipmentThepurposeofthistestmethodistodetermineproce-6.1DieShearTesterduresfordieshearstrengthtesting.6.1.1±5%accuracyoffullscale2Scope6.1.2Diecontacttoolcanbeincontactwithdieedge

2、fromend-to-end.2.1Thistestmethodshallbeusedforthemeasure-mentofthedieshearstrengthwhendieattachpasteis6.2HotPlate—optionalusedtobondadietoaleadframebondpad.6.3Microscope—optional2.2Thistestmethodshallbeusedforqualitycontrolanddevelopmentatdieattachpastesuppl

3、iersandfor7Materialincominginspectionandselectionofthedieattach7.1SiliconDie—2mm´2mm´0.3to0.5mmpasteatdieattachpasteusers.7.2Leadframe2.3Thistestmethodcanbeapplicabletodieattachmaterialbesidespastematerialandmaybeusedto7.3DieAttachPasteevaluateleadframebondp

4、adquality.8TestSpecimen3ReferencedDocuments8.1Dispensedieattachpastebydispensing,stamp-3.1MilitarySpecification1ing,orscreenprinting.MIL-STD-883—Method2019,DieShearStrength8.2Bonddieandleadframepad.8.3Curethepasteperrecommendationandallowto4Terminologycooltoa

5、mbient.4.1die—Semiconductordeviceoranimitation.NOTE1:Heightoffilletshallbelessthanhalfofthe4.2dieattach—Bonddieandsubstratesuchaslead-thicknessofthedie.framepad.NOTE2:Thicknessofdieattachpasteshallbewithin4.3diecontacttool—Toolforapplyingloadtothetherangeof5t

6、o30µmbeforeoraftercure.dieforshearing.NOTE3:Assembledpartsshallnotbeexposedtoa4.4dispense—Dealoutpaste.curingtemperaturehigherthanthepeakrecommendedtemperatureformorethan30seconds.4.5fillet—Heightandshapeofdieattachpasteincontactwithorsurroundingthediekerf.9S

7、amplingPlan4.6shear—HaveforcedcompletelyinX-Ydirec-Numberofspecimenstestedshallbe5ormore.tion.10Procedure5SummaryofMethod10.1Setatestspecimenonthediesheartester.Thismethodisbasedonmeasuringtheshearstrengthbetweendieandleadframepadbondedbydieattach10.2Confirmt

8、hatthediecontacttoolcontactsthediepasteusingdiesheartester.sideinhalfoftheareaormoreandthatthediecontacttooldoesnottouchthefillet.10.3Shearthespecimenwiththetester.10.4Recordthestrength.1Military

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