NPI（新品试制）作业流程

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1、NPI流程簡介EMDIII檢測張念2010.08.25AgendaProductLifeCycle(PLC)DellNPIDefinitionPCBAOEM/ODMNPIProcedureRYG,DFM,S/LReportinNPI專業術語介紹Q&AProductLifeCycle(PLC)RFQNPIRTSMPEOL客戶MarketMarketMarketProductLifeCycle(PLC)DFMECOHVMEOLDellNPIDefinitionBUUTPTSTQualPilotS/LBU(Brin

2、gUpboardassemblylevelbuild)UT(UnitTestboardassemblylevelbuild)PT(ProductTestboardassemblylevelbuild)ST/Qual(A-revcandidate.SystemTest/Qualboardassemblylevelbuild)Pilot/SafeLaunch(A-revassemblybuild)OEMODMDELLMPM生產作業ESIR&DDFxLead:ESISupport:PEDFxLead:PESuppo

3、rt:ESIOEMODMDesignLead:DELLSupport:otherDesignLead:R&DSupport:DELLOEM&ODMdifferenceBUUTPTSTQualBuildPilotBuildRTSMP樣品制作1.樣品制作2.產品驗証3.新制程開發及驗証試產及量產,模擬量產條件為批量生產做准備1.文件﹑程式﹑治具2.人員培訓3.制程微調4.新產品試產中出現的問題的解決PCBAOEMNPIProcedurePM發出NPIChecklist召開NPIOpenMeeting

4、生產前一周由PE主導召開產前會議NPIchecklistRYGReportCCL:CriticalComponentListL/T:LeadTimePO:PurchaseOrderWDN:WeeklyDeliveryNoticeConsignMaterial:客戶直接購買并送到CM的物料Upside:加量DSI:DaysSalesInventoryETD:EstimateToDeliveryETA(DockDate):EstimateToArrivalDFMinNPI·Higherquality·Reduce

5、dleadtimes·Lowerlaborandmaterialcosts·HigherfirstpassyieldsMinimizedenvironmentalimpactDellBOMHHBOMProglistMaterialPurchaseSOPLoadinglistTiptopBOMShipmentWorkOrderCustomBOMProductionIQCInspectBOM的轉換和作用DellBOMGerberFileAssemblyDrawingSchematicHHBOMSMTStencil

6、SMT比對板原始流程PTH載具組裝治具SMT程式關鍵元件DatasheetProfile設定SOPBOM的轉換和作用生管與工令Tiptop工令SFC工令物料數量清單包材需求數量SFC工令號,數量PPID申請注:1.同一料號不可以有兩個在制Tiptop工令;2.Tiptop工令結案周期為一周,超過一周為超期工令;3.SFC工令與Tiptop工令一一對應,SFC可設置多個小工令對應一個Tiptop工令;4.開重工工令時,如需從倉庫領板,則需開Tiptop工令,如僅領物料,用SFC工令即可由費用性領料;NPI首件確

7、認SMT元件正確性檢查(極性,位置)手貼元件是否被清楚定義在SOP上SMT元件焊點狀況檢查PTH元件位置正確性檢查PTH極性元件方向是否正確PTH元件焊點狀況檢查依照組裝圖,檢查所有Mechanical元件組裝是否與組裝圖一致產品上所有Label是否正確貼裝(PPID/REV/燒錄IC/UL)產品是否按POP要求正確包裝其它特殊要求是否正確相關術語解釋RTS:ReadyToShipmentMQT:Manufacture/Quality/TestRYG:Red/Yellow/Green,materialstat

8、usreportsendbySCMPMP:ProcessManagementPlanPFMEA:ProcessFailureModesandEffectsAnalysisSFC:ShopFloorControlSPC:StatisticalProcessControlSOP:StandardOperationProcedureICT:InCircuitTestFVS:FunctionalVerifi