Thermal management of high heat-flux sources using phase change materials - A design optimization procedure

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1、Copyright©1997,AmericanInstituteofAeronauticsandAstronautics,Inc.AIAA-97-2451THERMALMANAGEMENTOFHIGHHEAT-FLUXSOURCESUSINGPHASECHANGEMATERIALS:ADESIGNOPTIMIZATIONPROCEDUREV.Shanmugasundaram*UES,Inc.4401Dayton-XeniaRoad,Dayton,OH45432J.R.BrownnandK.L.Yerkes*AeroPropulsion

2、andPowerDirectorateWrightLaboratoryWright-PattersonAFB,OH45433AbstractNomenclatureAnumericalsimulationofheattransferAlAluminumprocesseswithinathermalmanagementsystemDtotaldepthofthesystem(TMS)basedonphasechangematerial(PCM)hasHtotalheightofthesystembeencarriedout.TheTMS

3、consistsofametallichheightcontainerenclosingaseriesofverticalmetallicfins/lengthwiththePCMinbetween.ThematerialsconsideredNflnnumberofverticalfinsarealuminumforthecontainerandthefins,andPCMPhaseChangeMaterialAristowaxforthePCM.AsteadyheatloadisappliedTMSThermalManagemen

4、tSystemtothebottomofthecontainer,whilethetopisTtemperaturesubjectedtoconvectivecooling.EffectofvariationstthicknessingeometryandinsystemmassonthethermalWtotalwidthofthesystemperformance(definedasthetimefortheheatsourcetoreachaspecifiedmaximumtemperature)hasbeensubscript

5、sstudiedtoprovidedesignoptionsfordevelopingTMSstosuitvariousneeds.Byvaryingthenumberbbottomplateofverticalfins,ithasbeenfoundthatincreasingthefinverticalfinnumberoffinsleadsnotonlytoasignificanthfinhorizontalfinimprovementinsystemthermalperformance,butmmiddlesectionalso

6、tonear-isothermalconditionoftheheatsource.meltphasechangettopplateMember,AIAA;CorrespondingauthorThispaperisdeclaredaworkoftheU.S.GovernmentandisnotsubjecttocopyrightprotectionintheUnitedStates.Copyright©1997,AmericanInstituteofAeronauticsandAstronautics,Inc.Introductio

7、nWiththeadventoftheAirForceMoreElectricAircraft(MEA)Initiative,moreandmoreconvectiveheatsinkhydraulic/pneumaticcomponentsarebeingreplacedbyhighpowerelectrical/electroniccomponentstoperformfunctionslikeprovidingauxiliary/emergencypowerandcontrollingtheactuatormotor.Itisp

8、rojectedthatsomeoftheelectrical/electroniccomponentstobeusedinthenextphaseoftheMEAPCM-bascdthermalmanagementsy