焊线及焊线工艺介绍

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1、WIREBONDPROCESSINTRODUCTIONCONTENTSASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT封裝簡介晶片Die金線GoldWire導線架LeadframWaferGrindingDieBondingWaferSawtoasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacementSingulationPacking封裝流程DejunkTRIM

2、SolderPlatingSolderPlatingDejunkTRIMTRIM/FORMINGBGASURFACEMOUNTPKGTHROUGHHOLEPKGWireBond原理padleadGoldwireBallBond(1stBond)WedgeBond(2ndBond)GLASSCONTAMINATIONVIBRATIONSiO2SiGOLDBALLPRESSUREMOISTUREAL2O3AlB.PRINCIPLE銲接條件HARDWELDINGPressure(Force)Amplify&FrequecyWeldingTime(BondTime)WeldingT

3、empature(Heater)THERMALBONINGThermalCompressureUltrasonicEnergy(Power)BondHeadASSYLowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith2.5micronperstepresolutionFastcontactdetectionSuppressedForcevibrationFastForceresponseFastresponsevoicecoilwireclampXYTableLinear3p

4、haseACServomotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-1mmResolutionof0.2mmW/HASSYchangeover·Fullyprogrammableindexer&tracks·Motorizedwindowclampwithsoftclosefeature·OutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtop

5、plateenablesfastdeviceEagleBondingSystemBondingMethodThermosonic(TS)BQMModeConstantCurrent,Voltage,PowerandNormal(Programmable)LoopTypeNormal,Low,Square&JXYResolution0.2umZResolution(capillarytravellingmotion)2.5umFinePitchCapability35mmpitch@0.6milwireNo.ofBondingWiresupto1000Progr

6、amStorage1000programsonHardDiskMultimodeTransducerSystemProgrammableprofile,controlandvibrationmodesMACHINESPECIFICATIONS(I)EagleVisionSystemPatternRecognitionTime70ms/pointPatternRecognitionAccuracy+0.37umLeadLocatorDetection12ms/lead(3leads/frame)LeadLocatorAccuracy+2.4umPostBondIn

7、spectionFirstBond,SecondBondWireTracingMax.DieLevelDifferent400–500umFacilitiesVoltage110VAC(optional100/120/200/210/220/230/240VACMACHINESPECIFICATIONS(II)EagleMaterialHandlingSystemIndexingSpeed200–250ms@0.5“pitchIndexerResolution1umLeadframePositionAccu