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ID:58742924
大小:4.56 MB
页数:96页
时间:2020-10-03
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1、CONTENTSASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT封裝簡介晶片Die金線GoldWire導線架LeadframWaferGrindingDieBondingWaferSawtoasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacementSingulationPacking封裝流程DejunkTRIMSolde
2、rPlatingSolderPlatingDejunkTRIMTRIM/FORMINGBGASURFACEMOUNTPKGTHROUGHHOLEPKGWireBond原理padleadGoldwireBallBond(1stBond)WedgeBond(2ndBond)GLASSCONTAMINATIONVIBRATIONSiO2SiGOLDBALLPRESSUREMOISTUREAL2O3AlB.PRINCIPLE銲接條件HARDWELDINGPressure(Force)Amplify&FrequecyWeldingTime
3、(BondTime)WeldingTempature(Heater)THERMALBONINGThermalCompressureUltrasonicEnergy(Power)BondHeadASSYLowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith2.5micronperstepresolutionFastcontactdetectionSuppressedForcevibrationFastForceresponseFast
4、responsevoicecoilwireclampXYTableLinear3phaseACServomotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-1mmResolutionof0.2mmW/HASSYchangeover·Fullyprogrammableindexer&tracks·Motorizedwindowclampwithsoftclosefeature·Outputindexerwithl
5、eadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdeviceEagleBondingSystemBondingMethodThermosonic(TS)BQMModeConstantCurrent,Voltage,PowerandNormal(Programmable)LoopTypeNormal,Low,Square&JXYResolution0.2umZResolution(capillarytravell
6、ingmotion)2.5umFinePitchCapability35mmpitch@0.6milwireNo.ofBondingWiresupto1000ProgramStorage1000programsonHardDiskMultimodeTransducerSystemProgrammableprofile,controlandvibrationmodesMACHINESPECIFICATIONS(I)EagleVisionSystemPatternRecognitionTime70ms/pointPatt
7、ernRecognitionAccuracy+0.37umLeadLocatorDetection12ms/lead(3leads/frame)LeadLocatorAccuracy+2.4umPostBondInspectionFirstBond,SecondBondWireTracingMax.DieLevelDifferent400–500umFacilitiesVoltage110VAC(optional100/120/200/210/220/230/240VACMACHINESPECIFICATIONS(II
8、)EagleMaterialHandlingSystemIndexingSpeed200–250ms@0.5“pitchIndexerResolution1umLeadframePositionAccuracy+2milApplicableLeadfram
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