CB印刷电路板制程介绍

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1、印刷电路板制程介绍FlowChartofPCBProcess123487651211109IQCTRIMDRILLBLACKHOLEDRYFILMLAMINATING1819201415101723222127262524EXPOSURE13DEVELOPMENTPATTERNPLATINGETCHINGINSPECTINGS/MSURFACECLEAN1’STLIQULDSCREENPRINTPRE-CURE2’STLIQULDSCREENPRINTPRE-CURES/MEXPOSURES/MDEVELOPMENTPOST-CURELEGE

2、NDPRINTCUREHAL/ENIGG/FPUNCH/NC-RV-CUTFINALCLEANCUREO/STEST/OSPHOLECOUNT2829303132FQCOQCPACKINGWARHHOUSHOUTGOINGSYMBOL□:QUANTITYINSPECTION◇:QULITYINSPECTION▽:STORAGE○:WORKING▲:100%INSPECTION(1)前制程治工具制作流程顾客CUSTOMER裁板LAMINATESHEAR业务SALESDEP.生产管理P&MCONTROLMASTERA/W底片DISK,M/T磁片磁

3、带蓝图DRAWING数据传送MODEM,FTP网版制作STENCILDRAWING图面RUNCARD制作规范PROGRAM程式带钻孔,成型机D.N.C.工程制前FRONT-ENDDEP.工作底片WORKINGA/W(2)多层板内层制作流程曝光EXPOSURE压膜LAMINATION前处理PRELIMINARYTREATMENT去膜STRIPPING蚀铜ETCHING显影DEVELOPING黑化处理BLACKOXIDE烘烤BAKINGLAY-UP及预迭板迭板后处理POSTTREATMENT压合LAMINATION内层干膜INNERLAYERIM

4、AGE预迭板及迭板LAY-UP蚀铜I/LETCHING钻孔DRILLING压合LAMINATION多层板内层流程INNERLAYERPRODUCTMLBAOI检查AOIINSPECTION裁板LAMINATESHEARDOUBLESIDE雷射钻孔LASERABLATIONBlindedVia(3)外层制作流程通孔电镀P.T.H.钻孔DRILLING外层干膜OUTERLAYERIMAGE二次铜及锡铅电镀PATTERNPLATING检查INSPECTION前处理PRELIMINARYTREATMENT二次铜电镀PATTERNPLATING蚀铜ET

5、CHING全板电镀PANELPLATING外层制作OUTER-LAYERO/LETCHING蚀铜TENTINGPROCESSDESMER除胶渣E-LESSCU通孔电镀前处理PRELIMINARYTREATMENT剥锡铅T/LSTRIPPING去膜STRIPPING压膜LAMINATION锡铅电镀T/LPLATING曝光EXPOSURE液态防焊LIQUIDS/M外观检查VISUALINSPECTION成型FINALSHAPING检查INSPECTION电测ELECTRICALTEST出货前检查OQC包装出货PACKING&SHIPPING涂布印

6、刷S/MCOATING前处理PRELIMINARYTREATMENT曝光EXPOSUREDEVELOPING显影POSTCURE后烘烤预干燥PRE-CURE喷锡HOTAIRLEVELING铜面防氧化处理OSP(EntekCu106A)HOTAIRLEVELINGG/FPLATING镀金手指镀化学镍金E-lessNi/Au印文字SCREENLEGEND选择性镀镍镀金SELECTIVEGOLD全面镀镍金GOLDPLATING(4)外观及成型制作流程典型多层板制作流程1.内层THINCORE2.内层线路制作(压膜)典型多层板制作流程4.内层线路制作

7、(显影)3.内层线路制作(曝光)典型多层板制作流程5.内层线路制作(蚀刻)6.内层线路制作(去膜)典型多层板制作流程7.迭板8.压合LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6典型多层板制作流程9.钻孔10.黑孔典型多层板制作流程11.外层线路压膜12.外层线路曝光典型多层板制作流程13.外层线路制作(显影)14.镀二次铜及锡铅典型多层板制作流程15.去干膜16.蚀铜(碱性蚀刻液)典型多层板制作流程17.剥锡铅18.防焊(绿漆)制作典型多层板制作流程15.浸金(喷锡……)制作干膜制作流程基板壓膜壓膜後曝光顯影蝕銅去

8、膜典型之多层板迭板及压合结构...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4p