PCB印刷电路板制程介绍

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1、印刷电路板制程介绍FlowChartofPCBProcess123487651211109IQCTRIMDRILLBLACKHOLEDRYFILMLAMINATING1819201415101723222127262524EXPOSURE13DEVELOPMENTPATTERNPLATINGETCHINGINSPECTINGS/MSURFACECLEAN1’STLIQULDSCREENPRINTPRE-CURE2’STLIQULDSCREENPRINTPRE-CURES/MEXPOSURES/MDEVELOPMENTPOS

2、T-CURELEGENDPRINTCUREHAL/ENIGG/FPUNCH/NC-RV-CUTFINALCLEANCUREO/STEST/OSPHOLECOUNT2829303132FQCOQCPACKINGWARHHOUSHOUTGOINGSYMBOL□:QUANTITYINSPECTION◇:QULITYINSPECTION▽:STORAGE○:WORKING▲:100%INSPECTION(1)前制程治工具制作流程顾客CUSTOMER裁板LAMINATESHEAR业务SALESDEP.生产管理P&MCONTROLMA

3、STERA/W底片DISK,M/T磁片磁带蓝图DRAWING数据传送MODEM,FTP网版制作STENCILDRAWING图面RUNCARD制作规范PROGRAM程式带钻孔,成型机D.N.C.工程制前FRONT-ENDDEP.工作底片WORKINGA/W(2)多层板内层制作流程曝光EXPOSURE压膜LAMINATION前处理PRELIMINARYTREATMENT去膜STRIPPING蚀铜ETCHING显影DEVELOPING黑化处理BLACKOXIDE烘烤BAKINGLAY-UP及预迭板迭板后处理POSTTREATME

4、NT压合LAMINATION内层干膜INNERLAYERIMAGE预迭板及迭板LAY-UP蚀铜I/LETCHING钻孔DRILLING压合LAMINATION多层板内层流程INNERLAYERPRODUCTMLBAOI检查AOIINSPECTION裁板LAMINATESHEARDOUBLESIDE雷射钻孔LASERABLATIONBlindedVia(3)外层制作流程通孔电镀P.T.H.钻孔DRILLING外层干膜OUTERLAYERIMAGE二次铜及锡铅电镀PATTERNPLATING检查INSPECTION前处理PRE

5、LIMINARYTREATMENT二次铜电镀PATTERNPLATING蚀铜ETCHING全板电镀PANELPLATING外层制作OUTER-LAYERO/LETCHING蚀铜TENTINGPROCESSDESMER除胶渣E-LESSCU通孔电镀前处理PRELIMINARYTREATMENT剥锡铅T/LSTRIPPING去膜STRIPPING压膜LAMINATION锡铅电镀T/LPLATING曝光EXPOSURE液态防焊LIQUIDS/M外观检查VISUALINSPECTION成型FINALSHAPING检查INSPECT

6、ION电测ELECTRICALTEST出货前检查OQC包装出货PACKING&SHIPPING涂布印刷S/MCOATING前处理PRELIMINARYTREATMENT曝光EXPOSUREDEVELOPING显影POSTCURE后烘烤预干燥PRE-CURE喷锡HOTAIRLEVELING铜面防氧化处理OSP(EntekCu106A)HOTAIRLEVELINGG/FPLATING镀金手指镀化学镍金E-lessNi/Au印文字SCREENLEGEND选择性镀镍镀金SELECTIVEGOLD全面镀镍金GOLDPLATING(4

7、)外观及成型制作流程典型多层板制作流程1.内层THINCORE2.内层线路制作(压膜)典型多层板制作流程4.内层线路制作(显影)3.内层线路制作(曝光)典型多层板制作流程5.内层线路制作(蚀刻)6.内层线路制作(去膜)典型多层板制作流程7.迭板8.压合LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6典型多层板制作流程9.钻孔10.黑孔典型多层板制作流程11.外层线路压膜12.外层线路曝光典型多层板制作流程13.外层线路制作(显影)14.镀二次铜及锡铅典型多层板制作流程15.去干膜16.蚀铜(碱性蚀刻

8、液)典型多层板制作流程17.剥锡铅18.防焊(绿漆)制作典型多层板制作流程15.浸金(喷锡……)制作干膜制作流程基板壓膜壓膜後曝光顯影蝕銅去膜典型之多层板迭板及压合结构...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4p