Microchip Fabrication, 5th Ed..pdf.pdf

Microchip Fabrication, 5th Ed..pdf.pdf

ID:34932999

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页数:611页

时间:2019-03-14

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1、TableofContentsChapter1TheSemiconductorIndustry--------------------2Chapter2PropertiesofSemiconductorMaterialsandChemicals-----------------------------------------------------26Chapter3CrystalGrowthandSiliconWaferPreparation----------------------------

2、-----------------------52Chapter4OverviewofWaferFabrication-----------------72Chapter5ContaminationControl---------------------------92Chapter6ProductivityandProcessYields-----------------140Chapter7Oxidation-----------------------------------------160

3、Chapter8TheTen-StepPatterningProcess—SurfacePreparationtoExposure-------------------------------------198Chapter9TheTen-StepPatterningProcess—DevelopingtoFinalInspection-------246Chapter10AdvancedPhotolithographyProcesses--------284Chapter11Doping-----

4、---------------------------------------326Chapter12LayerDeposition--------------------------------366Chapter13Metallization------------------------------------402Chapter14ProcessandDeviceEvaluation-----------------436Chapter15TheBusinessofWaferFabricat

5、ion-----------482Chapter16IntroductiontoDevicesandIntegratedCircuitFormation---------------------------------------------514Chapter17IntroductiontoIntegratedCircuits-----------554Chapter18Packaging----------------------------------------570Source:Micro

6、chipFabricationChapter1TheSemiconductorIndustryOverviewInthischapter,youwillbeintroducedtothesemiconductorindustrywithadescriptionofthehistoricproductandprocessdevelopmentsandtheriseofsemiconductorsintoamajorworldindustry.Themajormanufacturingstages,fr

7、ommaterialpreparationtopackagedprod-uct,areintroducedalongwiththemainstreamproducttypes,transis-torbuildingstructures,andthedifferentintegrationlevels.Industryproductandprocessingtrendsareidentified.ObjectivesUponcompletionofthischapter,youshouldbeablet

8、o:1.Describethedifferencebetweendiscretedevicesandintegratedcircuits.2.Definetheterms“solid-state,“planarprocessing”and“N-type”and“P-type”semiconductingmaterials.3.Listthefourmajorstagesofsemiconductorprocessing.4.Explaintheintegrationsc

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