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1、印制电路板用化学镀镍金工艺探讨(2)（Discussiononelectrolessnickelplatingforprintedcircuitboard(2)）Discussiononelectrolessnickelplatingforprintedcircuitboard(two)3technologicalprocessofelectrolessgoldplatingAstheelectrolessnickelplatingprocess,thefollowing6workstationscanmeettherequirementsofproduction:Oilremoval(
2、3~7min),microcorrosion(1~2min),preimmersion(0.5~1.5min),activation2~6min,7~11min,20~30min3.1AMMAT(Atotech)electrolessnickelgoldAurotechcompanyprocessAurotechisthecompanydevelopedAMMATelectrolessnickel/goldprocessproductname.Achemicalmethodforselectiveplatingofbarecopperareas(usuallysolderpadsorvi
3、as)ofaprintedcircuitboardaftermakingasoldermask.TheAurotechprocessallowsthedepositionofuniformelectrolessnickel/golddepositsonexposedcoppersurfacesandmetallizationholes,eveninsmallholeswithahighaspectratio.Aurotechisespeciallyusedinultrathincircuit,throughthebestcoverageedgeandthesidewalltocomple
4、telyresist,comparedwithhotairlevelingandAurotechnotparticularlyhightemperature,PCBwillnotproducethermalstressanddeformation.Inaddition,thehotairlevelinghasapoorcoverageonthecornersofthethroughhole,whileelectrolessnickel/goldisverygood.Inadditiontotheweldability,theAurotechcoatingalsohasgoodlapwel
5、ding,contact,conduction,andheatdissipation.ThetechnologicalprocessandoperationparametersofAurotechareshownintable1.Table1processflowandoperatingparametersofAurotechProcessnumber,processname,drugname,preparationconcentration,pHvalue,temperature,treatmenttime1acidcleaningagentCupraprosH2SO4(d=1.84)
6、100ml/L10ml/L<135~40~Cof4~63stagecountercurrentwashingoftapwater3~42microetchNa2S2O8H2SO4(d=1.84)100g/L20ml/L<125~35~Cof2~33stagecountercurrentwashingoftapwater3~43prepregH2SO4(d=1.84)50ml/L<122~32~Cof3~5ActivationofAurotech-activatorH2SO4(d=1.84)200ml/L50ml/L<123~25~Cof1~23stagecountercurrentwas
7、hingofdeionizedwater3~44CNNModsolutionofelectrolessnickelplatingonAurotechAurotechCNNANH3150ml/L60ml/L15~20ml/L4.8~5.382~90supplementsconcentratedwaterof20~30DEGCElectrolessnickelplatingtank3stagecountercurrentwashingo
