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1、印制电路板dfm通用技术要求(GeneralspecificationforprintedcircuitboardDFM)GeneralspecificationforprintedcircuitboardDFMThisstandardspecifiesthegeneralrequirementsfordesignformanufacturingsinglesidedprintedcircuitboard,includingmaterials,dimensionsandtolerances,printedwi
2、resandpads,metalholes,holes,mountingholes,coating,coating,characterandmark.Asdesignersofprintedboards,designasingle,doublesided(Single/Double,sided,board)reference:1Generalrequirements1.1.ThisstandardservesasageneralrequirementforPCBdesign,specificationsfor
3、PCBdesignandmanufacturing,andeffectivecommunicationbetweenCADandCAM.1.2weshallgiveprioritytothedesigndrawingsanddocumentsasthebasisforproductionintheprocessofdocumentation.2PCBmaterial2.1substratePCBsubstrateisusuallymadeofepoxyglassclothcoveredwithcopperpl
4、ate,thatisFR4.(includingsinglepanel)2.2copperfoilA)morethan99.9%ofelectrolyticcopper;B)doubleplatesurfacecopperfoilthicknessmorethan35m(1OZ);specialrequirements,specifiedinthedrawingsordocuments.3,PCBstructure,sizeandtolerance3.1structure(a)thedesignelement
5、sthatconstitutethePCBshallbedescribedinthedesigndrawings.TheappearanceshallbeuniformlyexpressedbyMechanical1,layer(priority)orKeepoutlayer.Ifusedinthedesigndocumentatthesametime,thegeneralkeepoutlayerisusedforshieldingwithoutopening,andmechanical1isusedtore
6、presenttheforming.(b)inthedesigndrawingsforopeninglongSLOTholesorhollowout,withMechanical1layerdrawthecorrespondingshapecan.3.2platethicknesstoleranceFinishedplatethickness0.4~1.0mm1.1~2.0mm2.1~3.0mmtolerance+0.13MM+0.18mm+0.2mm3.3dimensionaltolerancesPCBth
7、eoveralldimensionsshallcomplywiththerequirementsofthedesigndrawings.Whenthedrawingsarenotspecified,theoveralldimensiontoleranceis+0.2mm.(exceptforV-CUTproducts)3.4flatness(warpage)tolerancesTheflatnessofPCBshallbeinaccordancewiththedesigndrawings.Whenthedra
8、wingsarenotspecified,followthefollowingFinishedplatethickness0.4~1.0mm1.0~3.0mmWarpageSMT=0.7%;SMT=1.3%SMT=0.7%;SMT=1%4printedwiringandpads4.1layoutA)thelayout,linewidthandlinespacingofprintedwiresandp