SMT常用专业术语.doc

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1、SMT專門術語SMT:surfacemountingtechnology;Al:Auto-Insertion自動插件AQL:acceptablequalitylevel允收水準ATE:automatictestequipment自動測試ATM:atmosphere氣壓BGA:ballgridarray球形矩陣CCD:chargecoupleddevice監視連接元件（攝影機）CLCC:Ceramicleadlesschipcarrier陶瓷引腳載具COB:chip-on-board晶片直接貼附在電路板上cps:centipoises（

2、黏度單位）百分之一CSB:chipscaleballgridarray晶片尺寸BGACSP:chipscalepackage晶片尺寸構裝CTE:coefficientofthermalexpansion熱膨脹系數DIP:dualin-linepackage雙內線包裝（泛指手插元件）FPT:finepitchtechnology微間距技術FR-4:flame-retardantsubstrate玻璃纖維膠片（用來製作PCB材質）IC:integratecircuit積體電路IR:infra-red紅外線Kpa:kilopascals（壓

3、力單位）LCCHeadlesschipcarrier引腳式晶片承載器MCM:multi-chipmodule多層晶片模組MELF:metalelectrodeface二極體MELF:metalelectrodefaceBondingType:金屬電極無引腳端面元件MQFP:metalizedQFP金屬四方扁平封裝NEPCON:NationalElectronicPackageandProductionConference際電了包裝及牛產會議PBGA:plasticballgridarray塑膠球形矩陣PCB:printedcircui

4、tboard卬刷電路板PFC:polymerflipchipPLCC:plasticleadlesschipcarrier塑膠式有引腳晶片承載器Polyurethane聚亞胺酯（舌I」刀材質）PPM:partspermillion指每百萬PAD（點）有多少個不良PAD（點）PSI:pounds/inch2磅/英吋2PWB:printedwiringboard電路板QFP:quadflatpackage四邊平坦圭寸裝SIP:singlein-linepackageSIR:surfaceinsulationresistance絕緣阻抗SM

5、C:SurfaceMountComponent表iflj黏著元件SMD:SurfaceMountDevice表面黏著元件SMEMA:SurfaceMountEquipmentManufacturersAssociation走岔黏著設備製造協會SMT:surfacemounttechnology表面黏著技術SOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedpackageSOP:smallout-linepackage小外型封裝SOT:smalloutlinetransi

6、stor電晶體SPC:statisticalprocesscontrol統計過程控制SSOP:shrinksmalloutlinepackage收縮型小外形封裝TAB:tapeautomaticedbonding蒂狀白動結合TCE:thermalcoefficientofexpansion膨脹（因熱）係數Tg:glasstransitiontemperature玻璃轉換溫度THD:Throughholedevice須穿過洞之元件（贯穿孔）TQFP:tapequadflatpackage帶狀四方平坦封裝UV:ultraviolet紫外線

7、uBGA:microBGA微小球型矩陣cBGA:ceramicBGA陶瓷球型矩陣PTH:PlatedThruHole導通孔IAInformationAppliance資訊家電產品MESH網目OXIDE氧化物FLUX助焊劑LGA（LandGridAiry）封裝技術LGA封裝不需植球，適合輕薄短小產品應用。TCP（TapeCarrierPackage）ACFAnisotropicConductiveFilm異方性導電膠膜製程Soldermask防焊漆SolderingIron烙鐵Solderballs錫球SolderSplash錫渣Sol

8、derSkips漏焊Throughhole貫穿扎Touchup補焊Briding稿接（短路）SolderWires焊錫線SolderBars錫棒ResistorNetworksCapacitorNetworksHybri