Wire Bond 工作原理介绍

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1、課課課課一、課程目的THEPURPOSEOFCOURSE建立新ME對W/B與基本銲接理論之認識二、學員應學到的知識、技能、方法、標準作業程序、表單THEKNOWLEDGE,SKILLS,METHODOLOGY,SOP,CHECKLISTTHATTRAINEEWILLLEARNINCLASS1.新ME應該學習到銲接基本結構2.學習到W/B銲接的流程與時序三、此教材適用之對象THETARGETPARTICIPATOR新進ME四、訓練後學員評核方式課程程評核的方法─如考試、心得報告、OJT評鑑表等方式VALIDATIONMETHOD:EXEXAMINATION,REPORT,O

2、JTEVALUATIONFORM什麼是WIREBOND鋁墊銲金線L/FDIE一.W/B銲線基本理論:1.目前我們電子產品銲接是採用固態銲接，所謂固態銲接，就是金屬在未達熔解溫度下之銲接。決定固態銲接的要素有那些？二.BONDING(固態銲接)的四大基本要素:要如何才能得到最佳的銲接，主要要素如下A.壓力。(BONDFORCE)B.振盪功率。(BONDPOWER)C.銲接時間。(BONDTIME)D.銲接溫度。(TEMPERATURE)三.金球與鋁墊之最佳銲接:1.鋁墊之構造:a.最上層為少量水氣與雜質b.第二層為氧化鋁c.第三層才是純鋁d.第四層是二氧化鋁e.最下層就是矽

3、層2.最佳之銲接，就是金球與純鋁密切結合。故如何運用四大基本要素，掌控最佳配合時機為學習要旨。如壓力、振盪過大會造成缺鋁或矽崩過小昨則無法有效排除第一、二層與純鋁層作密切接合銲接。金球與鋁墊的銲接模式振盪(POWER)壓力(FORCE)水氣及雜質氧化鋁玻璃層金球純鋁二氧化矽層矽層溫度溫度鋁墊SEM側視圖BONDING時銲針位置之時序圖銲TORESET針RESET位置LOOPHEIGHT高度加速度REVERSELOOP留線尾逆打燒一個金球等速度等速度TIME時間KINKHEIGHT1STBONDTIME2NDBONDTIME*WIREBOND*鋁墊銲金線L/FDIEFree

4、airballiscapturedinthechamferpadleadFreeairballiscapturedinthechamferpadleadFreeairballiscapturedinthechamferpadleadFreeairballiscapturedinthechamferpadleadFreeairballiscapturedinthechamferpadleadFormationofafirstbondpadleadFormationofafirstbondpadleadFormationofafirstbondPRESSUREUltrason

5、icVibrationpadheatleadFormationofafirstbondPRESSUREUltraSonicVibrationpadheatleadCapillaryrisestoloopheightpositionpadleadCapillaryrisestoloopheightpositionpadleadCapillaryrisestoloopheightpositionpadleadCapillaryrisestoloopheightpositionpadleadCapillaryrisestoloopheightpositionpadleadFor

6、mationofalooppadleadFormationofalooppadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadpadleadFormationofasecondbondpadheatleadFormationofasecondbondpadheatleadpadheatleadpadheatheatleadpadleadpadleadpadleadpadleadpadleadpadlead

7、DisconnectionofthetailpadleadDisconnectionofthetailpadleadFormationofanewfreeairballpadleadWireBondedpadleadDie