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时间:2019-03-14
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1、Lam1SiliconNitrideEtcher(lam1)1.01.0TitleLam1SiliconNitrideEtcher2.02.0PurposeLam1isanautomatic,cassette-to-cassette,singlewaferplasmaetchermodifiedforsiliconnitrideetching.3.03.0ScopeThisdocumentdescribesthegeneraloperationofLam1.Italsocoversthereci
2、peloading/modifyingproceduresandhowtosetuptheautomaticendpointdetection.4.04.0ApplicableDocuments4.14.1Chapter7.0oftheMicrolabManual(LamEtchersOverview).4.24.2AutoEtchPlasmaEtchSystem,OperationandMaintenanceManual,LamResearch,1989.(ThereisacopyintheM
3、icrolaboffice.)5.05.0Definitions&ProcessTerminology5.15.1PlasmaEtcher:Anetcherthatusestheradicalgasatoms/molecules,generatedbyplasma,asthemainetchantstoremovethethinfilmmaterialonasubstrateorthesubstrateitself.5.25.2EtchRate(ER):Therateofthethinfilmb
4、eingetchedaway,usuallyinA/minute.5.35.3EtchNon-Uniformity:Ameasureoftheetchuniformityacrossthewafer.Itisdefinedas(maxER–minER)/(2XaverageER),usuallyin%.5.45.4Isotropic/AnisotropicEtch:AnetchprocessthathasthesameERinalldirectionsisisotropic.Anetchproc
5、essthatetchesinthedirectionperpendiculartothesubstratesurfaceisanisotropic.Aplasmaetcher,e.g.Lam1usuallyetchesmoreanisotropically.5.55.5EtchSelectivity:Ameasureofcomparingfilmlossbetweentheetchedthinfilmandotherlayers,suchasphotoresistorunderlayingsu
6、bstrate/film.Thehigherthisratio,themoredesirabletheprocess.5.65.6Over-Etch:Anoptionalsecondetchstepwithetchchemistrythatmaximizestheetchselectivity.Itremovestheresidualfilmduetopreviousetchnon-uniformitywithminimumdamagetotheunderlyingsubstrate/film.
7、Theetchrateisusuallylowerinthisstep.5.75.7AutomaticEndpointDetector:Anopticaldevicethattracesthelightemittedbytheetchbyproductintheplasma.Itcanbeprogrammedtoendtheetchprocessataspecifiedcondition.Lam1usesChannelA(405nm)tomonitortheamountofSiNspeciesi
8、ntheplasma.5.85.8Lam1-PC:APCusedforloadingetchrecipestoLam1.ControlPanelandCRT5.95.9STARTbutton:Startstheprocess.5.105.10STOPbutton:Stopsthewafersintheentrancecassettefrombeingsendingintothesystem.5.115.11RECIPEbutton:Displays,ontheCRT,therecipecurre
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