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ID:32356889
大小:26.60 MB
页数:64页
时间:2019-02-03
《thz光栅结构uvliga光刻工艺研究》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、ABSTRACTIt,sofconsiderableimportancetheapplicationsofTHzwaveincommunications,radar,probe,imagingandmore.Theorotronandbackwardwaveoscillatorwithgratingstructure,whichprovidecompact,highpower,highefficiencyandtunableproperties,possessgreatpotentialfordevelopment·MetalGrating,asthekeypartofte
2、rahertzsource,lSnotcompatiblewithtraditionalmachiningmethodsandcommonmicrofabricationmethodsduetoitssmallfeaturesize.UV-LIGAbasedonSU.8photoresistisakindofeffectiveandpracticalMEMStechnologytomeettheTHzgratingstructure’Sprocessingreauirements.AstheimportantprocedureofUV—LIGA,theeffectofpho
3、toetchingprocesshasacriticalinfluenceonthesubsequentmicro-electroformingprocess.ThispapercarriedoutresearchonprocessoftheTHzgratingstructuretosavetheproblemduringUV-LIGA.Accordingtothecharacteristicsofthephotoetchingprocess,theinfluenceofvariousprocedureonphotoetchingeffectwasanalyzed.Andw
4、eintroducedTaguchiorthogonalandonesteponefactormethodsintotheoptimizationoftheprocessingexpe血lental,Whichhadmulti.factorandmulti—levelfeatures.Firstphotoetchingprocessresearchonmonolayerfilmof94GHzand300GHzsinglegratingstructurewasinvestigated.Andtheoptimizationofpretreatmentprocedurebyexp
5、erimentswasacllieved.basedonwhichTaguchiorthogonalexperimentswereusedtofmdtheoptimalparametersofexposuretime、post—baketime,post-baketemperatureanddevelopmenttime.Meanwhilemostdecisivefactorwasacquiredbyanalyzingtheexperimentaldataandmorphologyoffilmstructure.Afterfurtheroptimization,theopt
6、imizedresultofphotoetchingprocessof94GHzand300GHzsinglegratingstllJcturewere0btained.Onmebasisofsingle—layerfilmtechnology,theexperimentalstudyofphotoetchingprocessof300GHzbi—gratingstructureofbi。layerfilmwasped.onIled.Theproblemssuchasimprovingtheflatnessofthefilmthickness,reducingmeefrec
7、tofstress,solvingthedifficultyofdevelopingliquidtransport,hadbeensolved.Finally,agoodmicromouldofbi-gratingwithsteepsidewallandsmoothsl】嘞cewasachievedbycombiningTaguchiorthogonalexperimentandonesteponefactormetllod,whichthicknessandaspectratiowere700Ⅳnand14:1,
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